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and these costs are becoming a big bottleneck with increased content volumes As a result, Gigabit Ethernet is now becoming the preferred interface for cellular backhaul and future evolutions to 4G may very well drive 10 Gigabit Ethernet rates Clearly point-to-point EoF and EoWDM will provide a strong fit for low-latency/high-reliability data backhaul between wireless access and core sites
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Many large ISPs and carrier backbones consist of IP routers and/or MPLS label switching routers (LSR) deployed at large point of presence (PoP) locations These sites commonly hub last-mile traffic and interconnect to each other using dedicated high-speed links, commonly OC-192 PoS However, many carriers are now scaling toward terabit-level router setups to support growing inter-PoP traffic requirements over public networks Here EoF and EoWDM offer the most amenable strategies for high-density point-to-point PoP interconnection Foremost, 10G Base-LW/EW (WAN) interfaces will provide good cost-effectiveness over more expensive OC-192 PoS router interfaces Secondly, the use of underlying WDM transport (via EoWDM) can extend such peering setups over much larger domains
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Future technology developments will continue to shape the EoF and EoWDM service sectors In particular, major advances are expected in three areas: improved DWDM designs, higher-speed Ethernet interfaces, and evolutions in optical network control These areas are highlighted briefly
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Ongoing advances in soft-optics for ROADM and OXC devices will continue to drive improved DWDM-layer capabilities in the metro and long-haul space In particular, photonic integrated circuit (PIC) technologies hold much promise in coalescing multiple discrete optical and electronic components onto a single substrate, for example, lasers, amplifiers, photo-detectors, filters, switches, and so on PIC devices can drastically reduce opto-electronic transponder costs which dominate carrier CAPEX and help lower nodal losses Indeed, this technology promises a true leap in capabilities by reducing footprints, increasing reach, and enabling more elaborate optical-layer monitoring Recently, some PIC-based transport and OXC solutions have already come to market and future evolutions are expected There is a lot of ongoing research in optical burst switching (OBS) and optical packet switching (OPS) technologies [3] These schemes introduce data-packet visibility at the optical layer by processing packet header routing information (and optically bypassing data segments) As such, OBS and OPS could conceivably support advanced EVPL and EPLAN/EVPLAN services However, both of these technologies face many technical and prove-in hurdles, and despite many years of study, remain far from real-world deployments [2]
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There is much ongoing debate in the data and optical networking communities about the next Ethernet rate 40 Gbps or 100 Gbps (The TDM hierarchy already specifies 40 Gbps OC-768/STM-256 as the next increment) Such extreme demands are being motivated by projections for massive data-center aggregation needs, ie, large numbers of 10 Gigabit Ethernet ports While some support maintaining Ethernet s traditional 10x scaling factor, others are contemplating a break from tradition in light of technological and cost factors There have been some impressive achievements in 40 Gbps OC-768/STM-256 transport with vendors demonstrating ultra-long haul reach and many tens of channels per fiber In fact, some OC-768/STM-256 products are even coming to market (eg, DWDM transport and router interfaces), and various carriers are planning 40 Gbps backbones Nevertheless, others are actively studying long-haul 100 Gbps transmission via either serial or parallel interfaces [15] Expectedly, serial transmission is much more challenging as it poses extreme constraints on associated serializer/deserializer devices, optical modulators, detectors, and so on Moreover, related SMF dispersion effects will mandate extensive compensation at much closer distances (10 20 km) Alternatively, parallel transmission ameliorates electronic barriers by streaming multiple data paths over separate DWDM wavelengths, for example, 10 10 Gbps or 4 25 Gbps As DWDM transceiver costs decline and PIC component integration becomes more commonplace, this approach opens up the very real possibility of Ethernet scaling to unprecedented terabit rates These issues will be closely studied in the relevant standards bodies in the coming decade
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