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Technology Description
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In today s access and metro networks, delivering broadband services to businesses is both an attractive business opportunity and a technical challenge Less than 20 percent of all businesses are serviced directly by fiber, and the copper plant, in some instances,
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TDM: Circuit Bonding
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can be over fifty years old Additionally, even recent copper installations are inherently limited in bandwidth Achieving true broadband speeds requires some means of combining multiple pairs into a common bandwidth pool Once established, this bandwidth pool should be utilized in a way that maximizes the revenue potential for both individual services or customers and services delivered to multi-tenant unit (MTU) locations Circuit bonding is a platform that addresses these network issues without adversely impacting the existing network infrastructure, and it can be used with both fiber and copper infrastructure Additionally, circuit bonding can support clients with higher rates than the individual transport facilities This capability is realized due to circuit bonding s ability to create a large pool of bandwidth between locations by concatenating multiple parallel transmission channels By creating a single pool of bandwidth, the boundaries normally encountered in each channel are replaced by a single boundary equal to the total bandwidth of all of the channels As long as a payload can fit into this concatenated channel, it can be transported and protected This capability is particularly beneficial when transporting signals that have bit rates greater than any individual line channel, transporting signals with formats that are not accepted neatly into the transmission channels, or mixing different types of signals in the same system
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The access infrastructure is the final frontier in broadband networking The single most limiting factor in the current access network is the availability of fiber to any given building Only by bonding or concatenating multiple channels can true broadband speed be achieved on wireline networks where there is no fiber connectivity While the standards bodies have recognized this bonding need with the development of virtual concatenation (VCAT) and link concatenation adjustment scheme (LCAS) for SONET, IMA for ATM, MLPPP for IP, and so on, each of these approaches is unique to the protocol or network supported Circuit bonding is created by using the current GFP/VC/LCAS standards Even if a building has fiber access, Multi-Service Access (MSA) platforms are not optimal for providing Ethernet transport A fundamental issue related to MSAs is that these platforms are either TDM- or IP-centric A TDM-centric MSA strands bandwidth when transporting IP since this type of MSA must use static multiplexing based on SONET STS boundaries Because the IP-centric MSA generally does not have the resiliency of SONET to transport TDM traffic, optimal transparent transport of Ethernet services has not been fully realized In most circumstances, bandwidth and transparency are traded off for the proper connectivity Traditional Ethernet access solutions use transport bandwidth inefficiently; therefore, the following issues need to be addressed when providing Ethernet transport services in the access network:
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Transparent transport of FE/GbE over available copper/SONET infrastructure Efficient concatenation of available bandwidth
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Solutions must be payload agnostic independent of data/ TDM client formats Solutions must be independent of fiber availability
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Circuit Bonding Technology
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Circuit bonding solves all of the major problems (just noted) that are associated with the transmission of Ethernet service in the MAN environment Ethernet frames are transported over the network using the ITU standard GFP/VC/LCAS scheme In many instances, it is desirable to concatenate or bond many different links either physical or virtual into a single virtual link or pipe Doing so offers customers or service providers several advantages, including increased efficiency of the physical transport medium and potentially simplified management of one link versus complicated management of several Let s examine the basic theory and standards utilized for circuit bonding
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