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Circuit-Bonding Platform
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Aggregated bandwidth across multiple physically diverse transmission channels, independent of line data rate and format Multiple clients mapped simultaneously into the aggregated line-side bandwidth Inherent compensation for variations in the arrival time of the aggregated channels Protection of client channels against individual channel failures Simple addition of transmission channels to the aggregated group
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Clients sharing concatenated bandwidth Concatenated bandwidth
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Shared access
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Concatenated transmission links
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Client-and line-side view of circuit bonding
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Cross connection of transmission channels between transmit and receive ends Ability to function as a stand-alone transport protocol
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Circuit bonding is independent of the transmission format or protocol It can be used to provide transport over virtually any line transmission type and was not developed for a specific network type Furthermore, the protection afforded by circuit bonding is available to all client signals regardless of their format Circuit bonding is also different from protocols that aggregate client-side interfaces While a circuit bonding platform can carry those clients over either single or multiple facilities, it can carry mixed format signals equally well As Figure 105 illustrates, those clients can be packet-based or TDM-based Circuit bonding can be used to carry Ethernet frames over bonded OCns, DS3s, and T1/E1s Figure 106 shows how this can be achieved Figure 106 shows Ethernet connectivity using a circuit-bonding system over DS-1, DS-3 transport, or SONET transport Because circuit bonding separates the client layer from the transport layer, Ethernet can be efficiently transported over a variety of parallel transport mechanisms with the following benefits:
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How Ethernet Frames Are Transported over Circuit-Bonded Networks
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Transparency Circuit bonding allows complete decoupling of the client interface and transport A point-to-point Ethernet connection using a circuit-bonding system will transport Ethernet frames from multiple clients over a variety of intermediate transport mechanisms completely transparently Efficiency A circuit-bonding system can throttle Ethernet client speeds in small increments, depending on the size of the transport pipe and the Ethernet bit rate This allows the service provider to offer fractional rate Ethernet services,
Transmission channels Frames Packet Client 1 Transmit TDM Client 2 Packet Client 3 Client 3 Receive Client 1
Client 2
Figure 105 Various client types carried by circuit bonding
TDM: Circuit Bonding
Ethernet client device GbE GbE DS1 DS3 OC-N Transmit DS1 DS3 OC-N Receive GbE
Ethernet client device GbE
Ethernet client device 10/100
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DS1 DS3 OC-N
DS1 DS3 OC-N
10/100
Ethernet client device 10/100
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instead of just 10, 100, or 1000 Mbps rates In addition, the ability to multiplex the client signals efficiently on just enough line-side transport allows these fractional services to be offered at lower cost points, and the line service can grow as the client base grows The amount of bandwidth used can be adjusted dynamically as Ethernet demand grows For example, suppose additional Ethernet demand requires the addition of a DS-3 line in a bonded circuit that is carried over a SONET device Because circuit bonding decouples the Ethernet layer from the SONET layer, the available bandwidth is dynamically increased in a transparent manner to the Ethernet layer Simple SONET STS-1 transport is preserved with no need for complex virtual concatenation
Adaptability Circuit bonding can transport Ethernet frames over a variety of line-side transport types These include optical transport, such as OC-3, OC-12, and OC-48, as well as DS-3 and DS-1 This allows the circuit bonding to be applied in a wide array of off-net and on-net situations Circuit bonding can extend the usefulness of existing transport networks, eliminating the expense of deploying next-generation SONET systems Circuit bonding can be used for any type of DS-3 facility Figure 107 shows the use of a circuit-bonding system with a variety of DS-3 facilities These DS-3 facilities may be transmuxed into SONET or transported over copper or radio Circuit bonding can also be adapted to copper facilities even if the Ethernet client is using optical interfaces Figure 108 shows the use of a circuit-bonding system over several existing and planned copper-line interfaces, including DS-3 (existing), DS-1, and E-1
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Ethernet client device GbE GbE Circuit-bonded system DS-3 DS-3 DS-3 OC-N
SONET NE
DLC facility
Ethernet client device 10/100
10/100
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