qrcoder c# Backward Compatibility Scalability in Objective-C

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Backward Compatibility Scalability
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Circuit bonding can be used to bond multiple TDM pipes together, forming large pipes for Ethernet and TDM traffic It can be scaled from bonding two T1s together to bonding two OC12s for a full-rate GbE requirement
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In the following section, we will look at the drivers that led to the development of this solution The main driver obviously is the rapid growth of data traffic coupled with the current architecture of the current transport network Ways must be developed to handle the current data traffic with the existing network infrastructure
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The Need for a New Transport Solution
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It has been a very long time since fundamental changes were made to the transport systems utilized by service providers The technology of copper-based systems predates that of fiber-based SONET systems developed in the 1980s At the heart of these systems lie multiplexers and switch fabrics optimized for the Time Division Multiplexing (TDM) networks they were designed to create What has changed is the mix of services required by customers as data has become the dominant payload Superficial modifications in transport systems have been made, but no fundamental changes have occurred to reflect the changing needs of data payloads Recently the introduction of Dense Wavelength-Division Multiplexing (DWDM) has dramatically lowered the cost of transporting bandwidth and facilitated the explosive growth in data traffic It is clear that a new generation of flexible transport equipment capable of supporting any type of payload is needed It is also important to decouple the line-side interface from the client-side interface, allowing each of them to evolve independently The immediate opportunity is to provide platforms that utilize the capability of the existing network and allow new data transport services to be offered It is also important that the same technology can be used as the basis for an efficient and economical transport infrastructure for both voice and data
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Circuit Bonding Standards Development
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The pre-standard circuit-bonding technology relies on a set of integrated processes to create a point-to-point connection It combines the capacity of multiple links into a single concatenated pipe This circuit/channel bonding provides several benefits First, the large pipe is a single entity reducing the number of connections that must be managed Next, payloads can be supported that require more capacity than is available in any of the individual channels, a gating issue for other systems Last, there is the efficiency of packing multiple payloads into a single large pipe Bonding is accomplished with a protocol that resides within the payload of the existing links Therefore, the links are not required to participate in any way and can be any bit rate or format, utilizing copper or fiber Skew compensation is included so the individual channels are not required to travel the same path through the network Historically, different types of payloads are not combined by transport systems into a single channel The ability to adapt payloads of any type is a differentiating factor for this new technology Each payload in the channel may be a different format and have different performance and bandwidth requirements Supporting requirements ranging from fixed bit rate (TDM) to burst data payloads are accomplished by mapping all clients into a common structure call a Payload Data Unit (PDU) Once in this common structure, the differences in the payloads are reflected in the amount of bandwidth and the priority assigned to each payload Another basic feature provided by circuit bonding is channel protection Failures in the individual channels are recognized quickly and inoperable channels are removed
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from service The payloads continue to be supported using the bandwidth available in the remaining operational channels This channel protection feature along with the skew compensation can be used to create robustness in the connection by diversely routing channels In this scenario, a single cable cut cannot disable the entire link The processes just described create a single large pipe with all the capacity available to the clients Priorities assigned to each client dictate the distribution of capacity, and data clients provisioned to burst compete with each other for this bandwidth (statistical multiplexing) The implementation of these basic functions creates a simple platform that is easy to operate, manage, and deploy The deployment of point-to-point circuit-bonding solutions allows the service provider to create new revenue from data services utilizing existing infrastructure These deployments are also the first step toward a modern full-featured transport platform The International Telecommunications Union (ITU) has passed several standards making circuit bonding an industry standard from the bonding of optical circuits (OC3 and OC12s) to DS3 and DS1s Additional work is being done in standardizing the service management issues for services derived from bonded circuits
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