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Circuit bonding is designed to provide Ethernet services to business customers where high levels of reliability and QoS are desired or required It requires the bonding of TDM circuits to achieve the level of services required When only best-effort traffic is sufficient for the application, the cost of circuit bonding may be higher than other solutions, such as copper bonding where only copper cables are required Secondly, the bandwidth of circuit bonding is still based on the hierarchy of the current TDM- and SONET-based network The granularity, while much better than the TDM network, is still not as smooth and flexible as other solutions The other shortcoming of circuit bonding involves the additional overhead requirements beyond the overhead associated with TDM/SONET While the overhead requirement for circuit bonding is relatively small, a portion will not be available for traffic transportation
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Figure 1015 provides an overview of how circuit bonding fits into carrier networks Circuit-bonding equipment can also be deployed in several modes (see Figure 1016):
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Point-to-hub mode In this scenario, a circuit-bonding hub can be deployed in the network core and can be used as a hubbing device for multiple CPE devices at customer sites These devices can be either circuit-bonding platforms, integrated access devices, or native Ethernet devices Point-to-point mode Circuit bonding can also be deployed in the success-based mode for Ethernet private line (E-Line) services In this case, circuit-binding equipment can be deployed after the customer order is received, and it will be installed on a point-to-point basis In this way, no advance investment will be required, and the system will only be installed after the circuit is sold
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Figures 1017 to 1021 illustrate various circuit-bonding architectures It is also important to note that with the exception of the circuit-bonding equipment, no other complementary assets are needed to deliver Carrier Ethernet to customers
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TDM: Circuit Bonding
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Customer premises IP core: MPLS, IP VPN, etc Data multiservice switch/ cross connect Ethernet TDM MSPP T1 frame Circuitbonding hub MSPP/ ADM ILEC central office L2/L3 switch/ router T1 terminal/ smarjack Nx T1 Circuitbonding equipment
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TDM: Broadband DCS
Voice: VoIP Frame or TDM relay Frame relay
Class 5 switch
Figure 1015 Circuit bonding in carrier networks
Point to Multipoint HQ/POP or Switch Site
Circuit Bonding Equipment
Customer Voice Network (VoIP or TDM)
Core Router Access Voice Switch Circuit Bonding Hub Circuit Bonding Equipment Customer Voice Network (VoIP or TDM) Point to Point
Access Circuit Bonding Equipment Circuit Bonding Equipment
Figure 1016 Circuit-bonding modes
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TDM voice LAN T1 Frac T1 Ethernet T1 Frac T1 Data center/SAN VoIP phone Frame relay Circuitbonding equipment
Deliver Ethernet transport services over circuit-bonded TDM circuits Prioritize mission-critical applications over other services Improve bandwidth utilization to > 90% Deliver new services over existing network assets WAN Bonded TDM circuits Flexible: Grow bonded pipe with needs Robust: Single circuit failure does not stop any single service Resilient: Route services over a single virtual connection
Figure 1017 Various circuit bonding architecture
Corporate main office Corporate router Circuitbonding equipment Access network
Corporate branch office Circuitbonding equipment
Branch office switch
Ethernet service at customer premises Flexible services NxDS1, NxE1, NxDS3, NxOCn, STMn circuits User-defined priority for individual services Transparent service end-to-end Ethernet services PBX trunking
Figure 1018 Using circuit bonding to link two corporate offices
Corporate site Circuitbonding equipment Access network NxDS1/NxE1 NxDS3 NxOCn/STMn Local SAN array Circuitbonding equipment
Remote data center
SAN array
Extend Ethernet ports to any location on TDM network Circuit-grade QoS of TDM access network Data storage, disaster recovery, data continuity
Figure 1019 Using circuit bonding to link corporate offices with a remote data center
TDM: Circuit Bonding
HQ/POP or switch site
Circuitbonding equipment Circuitbonding equipment Access network
Remote site Customer voice network (VoIP or TDM)
Core router
Customer LAN Customer voice network
Voice switch
Multi-service platform reduces cost to provide service Router port extension: Virtual port at remote site Bundled services over bonded T1: Ethernet, FR, ATM, VoIP Circuit bonding helps scale service Figure 1020
Circuitbonding equipment
Customer LAN Remote site
Circuit bonding used to offer multi-services in a corporate network
Central office Voice network Data center MSPP NxT1
T1 Ethernet CircuitLAN bonding NxT1
TDM voice
Circuitbonding hub
Kiosk
NxT1 Corporate
Corporate
Data center MSPP
Circuitbonding hub
NxT1 T1 Ethernet NxT1 Circuitbonding LAN NxT1
TDM voice
Voice network Central office
Kiosk
Corporate Connect remote sites over copper T1s No fiber build cost included in customer pricing Drop-in network element at each branch site Standard T1 circuit provisioning and OAM&P
Large corporate network using circuit bonding
10
Ongoing Developments
Circuit bonding is based on a set of ITU-T standards approved several years ago The development of these standards was initiated by large telecommunications carriers seeking to gain more benefits from their existing infrastructure and to provide a more efficient transport environment for data traffic over existing SONET/SDH-based transport system The following table shows the standards involved:
ITU Standard G7041/ Y1303 G7043/ Y1343 G8040/ Y1340 G7042/ Y1305 G8601/ Y1391 Description Generic framing procedure (GFP) Virtual Concatenation of Plesiochronous Digital Hierarchy (PDH) signals GFP frame mapping into Plesiochronous Digital Hierarchy (PDH) Link Capacity Adjustment Scheme (LCAS) for Virtual Concatenated Signals Architecture of Service Management in a Multi-Bearer, multi-carrier environment
The ITU standard documents listed in the previous the table are all approved and, released While small adjustments to these standards continue to be made through the contribution process, no major changes are expected The standard for circuit bonding is likely to be very stable The only area where standards work is still continuing is in the network management areas for circuit-bonding services Several contributions related to this are included in the approved standard G8601 Additional work is being done especially with N T1s and N DS3s Digital Communication Channel (DCC) standards for optical circuits (OC3s and OC12s) are well-defined and in use for circuit-bonded optical services
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