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Figure 1022 shows a typical corporate network with multiple remote sites and a data center This configuration will be used as the model for an economic assessment of circuit bonding This section evaluates the economic impact of circuit bonding from both the enterprise perspective and the carrier perspective It is important to point out that the economic impact of any technical solution must be equally applicable to end users as well as to carriers for it to be acceptable In this case, the economic impact of circuit bonding will be applicable to both parties In the example shown in Table 101, enterprise headquarters and the data center have fiber access None of the remote sites are served by fiber, and they are being served by copper pairs only All data traffic is considered to be mission-critical, and the enterprise requires a strict SLA to guarantee the quality and security of the connections
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TDM: Circuit Bonding
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Voice switch (DCS) Circuitbonding hub NxT1 Core Ethernet node NxOCn
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Figure 1022 Typical corporate network with multiple remote sites and a data center
Table 102 illustrates the carrier s perspective on how services can be provided today In this example, the two 10 Mbps Ethernet circuits cannot be served without the expensive construction of fiber to the two remote sites Optical equipment, such as SONET or SDH MSPPs, will also be required The following table shows the inefficiency of bandwidth utilization for the present solution and the inefficient use of bandwidth
TABLE 101 From Headquarters Headquarters Headquarters Headquarters Headquarters Headquarters Data center
Service Requirements from Enterprise s Perspective To Remote site A Remote site B Data center Remote site A Remote site B Data center ISP Application Voice Voice Voice LAN LAN Data Internet access Bandwidth 8 POTS lines 8 POTS lines 6 POTS lines 10 Mbps 10 Mbps 500 Mbps 10 Mbps Format TDM TDM TDM Ethernet Ethernet GbE Ethernet Ethernet
10
TABLE 102 From Headquarters Headquarters Headquarters Headquarters Headquarters Headquarters Data center
Service Requirements from Carrier s Perspective To Remote site A Remote site B Data center Remote site A Remote site B Data center ISP Application Voice Voice Voice LAN LAN Data Bandwidth Format Bandwidth Provided 1 T1 1 T1 1 T1 DS3 DS3 OC48 DS3
8 POTS Lines TDM 8 POTS lines 6 POTS lines 10 Mbps 10 Mbps 500 Mbps TDM TDM Ethernet Ethernet GbE Ethernet Ethernet
Internet access 10 Mbps
provided to the end user Any improvements in efficiency can help reduce cost for the carriers and improve profit margin
Bandwidth Bandwidth Provided Not Used 1 T1 1 T1 1 T1 DS3 DS3 OC48 DS3 16 DS0s 16 DS0s 18 DS0s 35 Mbps 35 Mbps 1900 Mbps 25 Mbps Inef ciency Percent 66% 66% 75% 78% 78% 79% 78%
From Headquarters Headquarters Headquarters Headquarters Headquarters Headquarters Data center
To Remote Site A Remote site B Data center Remote site A Remote site B Data center ISP
Application Voice Voice Voice LAN LAN Data Internet access
Bandwidth 8 POTS Lines 8 POTS lines 6 POTS lines 10 Mbps 10 Mbps 500 Mbps 10 Mbps
Circuit bonding can be used to help carriers improve profit and reduce cost and at the same time provide Ethernet services to all areas, including those not served by fiber End users can also take advantage of circuit bonding to reduce their communication cost and improve service as well The following table shows the connections for the enterprise using circuit bonding
Bonded Service 7 T1s 7 T1s 3 OC3 6 T1s Bandwidth Provided 108 Mbps 108 Mbps 465 Mbps 926 Mbps Bandwidth Percent Used Used 105 Mbps 105 Mbps 465 Mbps 926 Mbps 97% 97% 100% 100%
From Headquarters Headquarters Headquarters Data center
To Remote site A Remote site B Data center ISP
Applications Voice and Ethernet Voice and Ethernet Voice and GbE Internet access
In this example, the number and capacity of the circuits are greatly reduced, and the circuits are fully utilized By using the multiplexing gain functions of circuit bonding, two of the circuits are not fully provisioned
TDM: Circuit Bonding
Vendors Promoting This Solution
To provide a list vendors promoting a circuit-bonding solution, it will be necessary to separate the list into three different categories:
N STSs N DS3 N T1s
The vendors included in this list represent only a sample of vendors providing circuitbonding solutions
Vendors N STSs Lucent Alcatel Fujitsu Cisco Tellabs Ceterus Networks N DS3 Ceterus Networks N T1s Ceterus Networks Zhone ANDA N T1s N T1s N T1s N DS3s N STSs, N VT15 N STSs, N VT15 N STSs, N VT15 N STSs, N VT15 N STSs, N VT15 N STSs, N VT15 Products
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