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into a liquid plastic and laid out to dry Both of these techniques, and more, are used to protect the circuit and to displace excess heat from the hybrid assembly A completed hybrid will take advantage of different circuit construction techniques, such as thin- and thick-film resistors (which can be printed and trimmed directly on the hybrid s substrate), SMD IC chips, SMD capacitors, flip-chips, trace coils, and microstrip transmission lines In fact, hybrid manufacture is basically a method of constructing a circuit on a specialized PCB by employing any desired electronics technology that is available so that we may decrease both the size and the cost of a circuit, while increasing reliability and performance Most of the actual ICs placed on a hybrid board are in their unpackaged form, even though many hybrids can and do use packaged SMD ICs But the ability to exploit ICs in their bare die form means that the size and cost of the entire hybrid circuit can be significantly improved The bare die is first attached to the hybrid PCB with an epoxy that is optimized for thermal conductivity and/or electrical conductivity, or the epoxy may insulate the bare chip both thermally and electrically from the PCB, depending on the application The chip s bond wires are attached to the hybrid PCB s metallization layer by a wire-bonding process This process will rely on the type of bonding wire used out of the bare die Gold wires require thermosonic bonding, while aluminum wire will need an ultrasonic procedure Both methods demand a special machine that utilizes a chiseled point that contacts the wire, pressing it against the board s surface metallization while vibrating at ultrasonic frequencies Thermosonic bonding for gold wires, as its name implies, also adds heat to this process A superior bare die attachment technique does not use wire bonding at all and obtains much decreased inductive effects Instead, small solder balls are attached to the IC s connection points The chip, now called a flip-chip, is affixed to the board by turning the IC chip over so that its solder balls are in contact with the pads of the board s metallization layer The entire assembly is then heated, causing the flip-chip to be permanently melded to the PCB, both mechanically and electrically There are other methods of attaching a bare die to a PCB, such as tape automatic bonding and adhesive-bonded microbumps For more detailed information on these processes, consult Hybrid Microelectronics Handbook by Sergent and Harper All of the other SMT components, such as the transistors, packaged RFICs, capacitors, resistors, and inductors, can be attached to the substrate s metallization layer by the reflow soldering process, which employs a solder paste that is printed onto the PCB and heated, causing the solder to reflow, electrically and mechanically connecting the components to the board
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The composition of the substrate and conductor materials are an important consideration in any high frequency PCB design, and hybrids are no different
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Downloaded from Digital Engineering Library @ McGraw-Hill (wwwdigitalengineeringlibrarycom) Copyright 2004 The McGraw-Hill Companies All rights reserved Any use is subject to the Terms of Use as given at the website
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Metallization is the conductive layer of the interconnecting traces and pads placed onto the substrate It can be made of copper, gold, or silver deposited on the substrate board material The entire PCB itself can be called a metallized substrate in these hybrid applications The board material is usually a type of ceramic, such as alumina, aluminum nitride, or beryllia These ceramics are extremely rigid and are quite temperature stable, besides having a very highstrength characteristic, attributes that make ceramics perfect as a substrate material for hybrid applications Alumina (aluminum oxide) is by far the lowest in cost and most popular It is a high-frequency (up to 25 GHz), very hard substrate material that does not require a carrier (heavy metal stiffening plate), and has a very high dielectric constant of around 98 (for small circuit layout sizes) This material is used in applications that require rigidity, strength, and temperature stability, along with decent thermal conductivity The next substrate, aluminum nitride, is found only in specialized hybrid applications that require better thermal conductivity, but at a substantially increased cost, over alumina Beryllia (beryllium oxide), which is even higher in cost than aluminum nitride, is seen in applications where low dielectric constants are needed (around 6), as well as improved thermal conductivity However, Beryllia dust particles are toxic, and must not be inhaled when this dangerous substrate material is machined 106 Direct-Conversion Receivers
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