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Objective 31 Objective 32 Objective 33 Objective 34
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Tag Components and Construction Tag Types Tag Performance Tag Selection
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MIKE MEYERS COMPTIA RFID+ CERTIFICATION PASSPORT
RFID tags, along with interrogators, antennas, and peripheral devices, form a physical layer of the RFID system In 2, you read about the phenomena of electromagnetic wave propagation and inductive and backscatter coupling RFID tags use these phenomena to communicate with interrogators In this chapter, you will read about RFID tag components and subassemblies, types of tags and reasons for using various types of tags, tag performance parameters, and tag selection criteria A tag is usually designed to suit a particular purpose, such as mounting on metal or embedding in tires A tag s behavior changes according to the material to which it is attached and the condition of the surrounding environment Therefore, selecting an appropriate tag for the object material and properly applying it to the object is the most important factor in the successful deployment of an RFID system
Objective 31
Tag Components and Construction
FID tags are made of three different components: integrated circuit (IC), antenna, and substrate, as shown in Figure 3-1 A tag manufacturer typically does not make all three components in-house The IC is typically designed and made by a semiconductor manufacturer, while an antenna is usually designed and made by a tag manufacturer Tags are available in various sizes, designs, and form factors, and they can be customized for a particular application Unless you need a very large number of tags, you should try to use stock tags because customized tags can be very expensive
Integrated Circuit
An IC, also called an electronic circuit, microchip, or chip, is designed and manufactured by a semiconductor manufacturer Designing ICs requires knowledge and experience in the technology, and their manufacture requires expensive equipment Therefore, ICs are often designed by one company, manufactured by another, and used by a third company that assembles the components to cre-
CHAPTER 3 Tag Knowledge
Integrated circuit
Substrate
FIGURE 31
RFID tag components and interconnection
ate a tag One IC may be used for many different types of tags by different tag manufacturers The IC has a logic unit that makes decisions and provides memory to store data Actually, the IC is a small microprocessor, and the latest ones have 40,000 to 50,000 transistors, more than the original IBM PC The IC needs power to operate This power may come from a battery on the tag (in an active tag) or it may be obtained from the radio energy radiated by the interrogator antenna (in a passive tag) A part of the IC is dedicated to controlling power The processing logic implements the communication protocol It also is used to modulate/demodulate signals and to encode/decode digital bits during the communication between the interrogator and the tag The memory on the IC may be divided in different blocks, called banks A block may be a read-only type, a write-one-time-only type, or a write-many-times type Tags use electrically erasable, programmable, read-only memory (EEPROM) This type of memory does not require continuous power to store data Therefore, data stored on the tag is retained for a long period (several years), even though no power may be available to the tag during this period The type of data stored in the memory depends on the protocol used The IC may store tag ID, object identifier, password, and error detection code such as cyclic redundancy check (CRC)
MIKE MEYERS COMPTIA RFID+ CERTIFICATION PASSPORT
Local Lingo
ROM and WORM Read-only memory is called ROM and write-onetime-only memory is called WORM, for write-once-read-many
ICs are created on a large semiconductor wafer One wafer can contain 40,000 ICs Manufacturing of ICs requires state-of-the-art clean room facilities The finished ICs are individually tested to ensure reliable functionality in the field With advances in semiconductor technology, ICs are becoming smaller as small as a grain of sand The smaller the IC, the lesser the cost and power required to operate it Making tag ICs more efficient in power usage and requiring less power to operate increases the read range of passive tags The ICs on each wafer need to be cut and separated and then attached to a tag antenna As the size of IC decreases, it requires more precise equipment to connect it to the antenna, which can increase the cost of assembling the tag
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