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Fig 124: A sectional view of an MOS transistor: (a) a minimum dimensional MOS transistor and (b) a 16 KB
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Precision Engineering
With reference to Figure 11 and Figure 15, it can be seen that nanotechnology concerns the integrated manufacturing technologies and machine tool systems, which provide an ultra-precision machining capability of the order of 1 nanometre (0001 m = 1 nm) This technology is perhaps today s most advanced manufacturing technology The Precitech Nanoform Series, for example, Nanoform 200 (Figure 125) has viable features for carrying out ultra-precision work The machine has a high performance, ultra-precision machining system designed for the most demanding aspherical turning and Fig 125: The Precitech Nanoform 200 Ultragrinding applications It has a swing diameter precision machine tool capacity of 700 mm and can be utilized for single-point diamond turning and peripheral grinding One of the pioneers involved in the development of the Diamond Turning Machine is Jim Bryan of the Lawrence Livermore National Laboratory, California who also contributed to the design of the Large Optic Diamond Turning Machine (LODTM), shown in Figure 126 [18,19] The LODTM, which was developed in the late 1970s, is a vertical spindle bridge-type (portal) machine that was designed to fabricate large optical components (eg, mirrors for telescopes) using a diamond tool, to an accuracy of 0028 m rms (11 in), as discussed in the book, with a surface finish of the order of 42 Ra (017 in) This would Fig 126: The (LODTM) designed and built by the allow infrared optics to be machined without Lawrence National Laboratory [18, 19] the need for subsequent polishing One of the well-known examples of products derived from ultra-precision machining is the Hubble Space Telescope (HST) as shown in Figure 127 [3] The HST which is a telescope orbiting the Earth at the outer edges of the atmosphere is a space observatory under the Great Observatories program The Hubble is a reflecting telescope having two mirrors The main mirror which has a diameter of about 24 m and which was erroneously ground into a slightly incorrect shape was later
Precision Engineering corrected by using Corrective Optics Space Telescope Axial Replacement (COSTAR), which is an optics package Using COSTAR, the telescope can achieve optical resolutions better than 01 arc seconds The Hubble has contributed to an extraordinary variety of astronomical discoveries, the most notable among them being the confirmation of dark matter, observations supporting the current accelerating universe theory, and studies of extra solar planets
Fig 127: The Hubble Space Telescope [3]
191 Ultra-precision Processes and Nanotechnology
The most noteworthy developments in processes capable of providing ultra-precision are as follows [3]: (a) Single-point diamond and cubic boron nitride (CBN) cutting (b) Multi-point abrasivecutting/burnishing,forexample,indiamondandCBNgrinding,honing, etc (c) Free abrasive (erosion) processes such as lapping, polishing, elastic-emission machining and selective chemico-mechanical polishing (d) Chemical (corrosion) processes such as controlled etch machining (e) Energy beam processes (removal, deformation and accretion) including those given below: (i) Photon (laser) beam for cutting, drilling transformation hardening and hard coating (ii) Electron beam for lithography, welding (iii) Electrolytic jet machining for smoothing and profiling (iv) Electro-discharge (current) beam (EDM) for profiling (v) Electrochemical (current) (ECM) for profiling (vi) Inert ion beam for milling (erosion) microprofiling (vii) Reactive ion beam (etching) (viii) Epitaxial crystal growth by molecular-bit accretion for manufacturing new super-lattice crystals, etc Electron beam process A typical example of an electron beam process (lithography) is shown in Figure 128 This involves ridges that are 30 nm high and 30 nm wide in gallium arsenide produced in a double-layer of a polymethyl methacrylate (PMMA) resist by exposure to a 50 KeV electron beam [3] Nickel-chrome was used as a mask for the subsequent reactive ion etching process
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