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Microelectronics have allowed further Fig 81: Comparison of a MEMS device with a strand of hair and blood cells [4] developments in the area of MEMS The boom in microelectromechanical systems would not have been possible without the advancement of microelectronics technology Therefore, before going into detail on MEMS, it will be beneficial to have some basic knowledge on the advances in the field of microelectronics Early works by Ferdinand Braun and Gugeilmo Marconi led to a further development in electronics [5] The invention of vacuum tubes led to the invention of the first computer in 1947 This was followed by the fabrication of the first transistor by John Bardeen, Walter Brattain and William Shockley who shared the Nobel Prize for their invention in 1956 The concept of MEMS was first put forward in 1958 by Jack Kilby with the invention of Integrated Circuits (ICs) which consist of a large number of individual components (transistors, resistors and capacitors) fabricated side by side on a common substrate and wired together to perform a particular circuit function The component counts per unit area for ICs double every two years while the feature size reduces, which allows an increase in complexity Figure 82 shows Moore s Law, named after Gordon Moore, a co-founder of Intel [4] The idea of ICs was further developed to incorporate a mechanical function to fabricate MEMS Microsystems and microelectronics share many common fabrication technologies In fact, microfabrication is often attributed to have led to the invention of the transistors and integrated circuits (ICs) Although there are similarities, the differences between the two are also worth discussing The significant differences are summarized by Hsu [6] as follows: When compared to microelectronics, microsystems involve materials that are more different Microsystems are designed to perform a greater variety of functions than microelectronics Microsystems involve moving parts such as microvalves, pumps and gears Integrated circuits primarily have a two-dimensional structure, but most microsystems involve a complicated three-dimensional geometry
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Fig 82: Moore s law showing the increase of component counts per unit area [4]
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Microsystems need to be in contact with the working media through sensing elements, whereas microelectronic devices are typically isolated from the surroundings Packaging technology for microelectronics is relatively well established, whereas microsystems technology is in its infancy
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MEMS
MEMS are characterized by miniaturization, multiplicity and microelectronics Figure 83 shows the comparative sizes of MEMS devices The three characteristics of a MEMS device can be clearly seen from the example of the inertial sensors The conventional inertial sensor system is shown in Figure 84, whereas the comparison with micromachined system is shown in Table 81 Table 81 clearly indicates the superiority of a micromachined system in terms of size, cost and function The reduction in size tends to give many advantages A smaller system has a lower inertia of mass enabling the system to move more quickly Since the resonant vibration of a system is inversely proportional to the mass, microsystems are less prone to thermal distortion and vibration In addition, miniaturization allows for stable, more accurate and precision performance for application in the field of medicine, surgery, satellites, spacecraft engineering and telecommunication systems [6]
Microelectro-mechanical Systems (MEMS)
Fig 83: Relative sizes of MEMS devices with the dimension in meters [4]
Figure 85 clearly shows the classification of the microtechnology of optical, electrical and mechanical systems Microtechnology is a miniaturized combination of optics, electronics and mechanics Other than microelectromechanical systems (MEMS), there also exists a branch known as Micro Opto Electro Mechanical Systems (MOEMS) [2]
6 dof Mo-Shapal Inertial Sensor, inside vacuum vessel, equipped with In-House Electronics mounted on 5 dof Micromanipulator
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