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Mounted points sometimes known as mounted wheels or grinding pins are commonly used as grinding tools for internal grinding operations Besides the above applications, these wheels can be used as deburring tools to remove recess material after the machining processes, smoothing out casting risers, fins and repair welds They come in various types and shapes to suit different applications (Figure 48 (a c)) Materials such as tungsten carbide and abrasives can be used for the tool Mounted tools made from tungsten carbide (Figure 48 (b)) are commonly used for smoothing die cavities, chamfering
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Fig 46: The standard marking system for a conventional bonded abrasive wheel [7]
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corners and forming fillets [7] [23] Mounted tools using abrasives include those made of aluminium oxide, silicon carbide and diamond Figure 48 is of interest as it indicates the use of tungsten carbide (WC) as an abrasive for deburring WC abrasives are also used for grinding rubber such as in fax machine rollers This figure also suggests the use of disc shape grinding wheels A similar shape was used by Venkatesh et al for the binderless diamond grinding wheel for machining IC chips
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429 Bondless Diamond Grinding Wheel
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The idea of using a bondless wheel emanated at UTM, and its conversion into a product was made possible by a US company This wheel was successfully tested at UTM, and an application for a Malaysian patent was filed [26] Figure 49 (a) indicates the wheel shape, and the nominal size of the wheel When the wheel is in use, it is fitted to a shank as shown in Figure 49 (b)
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Fig 47: The standard marking system for a superabrasive bonded wheel [7]
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The wheel is produced by depositing diamond on a metal, commonly a carbide substrate Three types of wheels can be found based on the type of the deposition method applied Figure 410 shows the diamond grain structure of each type of wheel Unlike a bonded wheel, the diamond layer is only on the top of the substrate surface and can be of a very fine grain size, whereas the smallest grain in bonded wheels must be larger than that of the bond The maximum grain size can go up to 10 m However, it has a higher density than diamond grains The bondless diamond wheel was tested to machine Pyrex glass, silicon dies and packaging chips Pyrex glass and silicon dies were machined changing the feed and the depth of the cut to investigate the machining mode and the surface finish Ductile streaks were observed on both surfaces (Figure 411) The achievable surface finish was found to be of an order of 01 m The packaging chip was machined in order to examine all the six Cu trace layers Chip packaging machined quite easily with binderless wheel revealing Cu layers The flatness of the bondless wheel helps in the planar delayering of the chip packaging as seen in Figures 412 without the need for polishing Minor defects in the horizontal copper traces and major ones in the vertical viaducts that link the Cu traces are evident in these micrographs The invention of this bondless diamond grinding wheel has made the machining of the silicon die and the chip packing much easier and more economical It has the potential of grinding glass and infrared optical materials, Si and Ge
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Fig 48: (a) Different sizes of Winter diamond-grinding pins that are normally used for internal grinding operations
available with both resinoid and metal bonding materials [24] (b) Tungsten carbide deburring tools in various shapes ideally suited for fast stock removal on hard materials [25] (c) Various shapes of aluminium oxide/silicon carbide mounted points used together with a portable hand grinder for general purpose grinding and deburring on most ferrous and non-ferrous materials
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