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Never has there been such a sweeping change in electronics manufacturing as imparted by WEEE and RoHS particularly the latter. Every industry is being impacted either by processes and materials or materials availability.
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Components Generally, ICs, passive devices, and connectors are not rated to survive temperature excursions much above that of eutectic Sn-Pb solder and are rated only to survive a brief thermal cycle. IC makers and component manufacturers have worked to understand the impact of the higher process temperatures required for Pb-free soldering. Plastic encapsulated components are known to absorb water from the atmosphere.As these components are heated to reflow soldering temperature, the water expands and can cause component cracking. This phenomenon is popularly known as popcorning since the plastic package often bulges prior to cracking and remains deformed upon cooling. To counter this, plastic packaged components are baked out prior to soldering.The higher temperature regimes of most lead-free solders will exacerbate the issue of popcorning requiring more attention to component drying cycles. In addition, the higher reflow temperature of Pb-free soldering has
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LEGISLATION AND IMPACT ON PRINTED CIRCUITS
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necessitated revamping of the classification schedule for package moisture sensitivity. This is especially relevant to components that are not hermetically sealed. Also, longer bake-out cycles are likely required. Many components, such as ICs and passive devices (resistors, capacitors, and so on), may not be suited for the higher process temperatures generally associated with lead-free soldering. The higher temperature may result in changes to electrical characteristics, cracking, melting, or other component damage or degradation. Only components certified by the parts manufacturer or by the user should be considered for Pb-free assembly. The manufacturer of each component assigns it a moisture sensitivity classification that dictates how long the component can be stored in a normal workplace environment before requiring a controlled bake-out cycle. Detailed information can be found about component moisture sensitivity classification, storage conditions, and bake-out requirements in joint industry standards J-STD-0201 and J-STD-033.2 In addition to changes in moisture sensitivity, component laminates, encapsulants, or overmolding compounds may be prone to degradation as a result of the higher temperature exposures and times. Other negative attributes are associated with the move to Pb-free solders. Most of the Pb-free solders are poorer wetting (slower to spread on a solderable surface), have grainer appearance (which is not necessarily a negative attribute, but different from what is generally accepted as a positive attribute in lead-based solder joints). With the advent of Pb-free solders as a mainstream technology, electrical components meant for surface mounting are being reformulated or requalified to withstand the higher requisite temperatures of Pb-free processing. Similarly, standards organizations such as the Joint Electron Devices Engineering Council (JEDEC) have respecified the maximum safe temperature regime for components due to the generally higher reflow soldering temperature required for Pb-free soldering. The process engineer must consult component manufacturer s specifications to establish safe reflow parameters for Pb-free soldering.
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Workmanship Standards The most widely used workmanship standard, IPC-A-610, has been rewritten to accommodate the inspection of Pb-free soldered assemblies. The changes were introduced with version D of that document. Inspection personnel require retraining to give proper attention to the changes and renewed inspection criteria.
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Laminates Many of the widely used printed wiring board (PWB) laminates for leaded (Pb d) solder assembly will not endure the higher temperatures of Pb-free processing. Only laminates with characteristic high-glass transition temperature (Tg) and high-decomposition temperature (Td) should be investigated for use in the Pb-free process. PWB laminates are more likely to sag during Pb-free reflow. Some may even darken in color or delaminate when exposed to Pb-free soldering temperatures. Careful attention to material selection and testing is a must for Pb-free soldering. Reformulation of circuit board laminates for higher temperature use is required to reduce the possibility of warpage, charring, delamination, sagging, via- or barrelcracking, and so on. High-temperature PWB laminates are available but are typically more expensive than those used for Sn-Pb processing.
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1 J-STD-020: Joint IPC-JEDEC Standard for Moisture-Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, Joint Electron Device Engineering Council (JEDEC),Arlington,VA, USA, and IPC-Association Connecting Electronic Industries, Bannockburn, IL, USA. 2 J-STD-033: Joint IPC-JEDEC Standard for Handling, Packing, Shipping, and Use of Moisture-Reflow Sensitive Surface Mount Devices, JEDEC, Arlington, VA, USA, and IPC, Bannockburn, IL, USA.
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