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is of uniform composition and at a temperature of 245 C (473 F). Immerse the specimen edgewise into the molten solder. The insertion and withdrawal should be at a rate of 1 in. per sec. and the dwell time in the solder should be 4 sec. Upon withdrawal, allow the solder to solidify by air-cooling while the specimen is in a vertical position. Thoroughly remove the flux. The samples are examined for any evidence of discoloration or surface contaminants, loss of surface resin, softness, delamination, interlaminar blistering, or measles. The specimens having metal cladding also need to be examined for blistering or delamination of the metal foil from the laminate material. 12.5.2.3.2 Solder Float Resistance. This test addresses the thermal resistance of the laminate material floating on the solder bath. Because this method subjects the sample to a thermal gradient across the z-axis of the material similar to an actual wave solder operation, the results of this test are particularly important and as mentioned previously either solder pot temperatures or exposure times should be increased if the laminates are intended for use in lead-free assembly processes. The test method follows IPC-TM-650, method 2.4.13. At least two samples need to be tested for each material and they should be taken from random locations. For double-clad laminate, the copper foil needs to be removed from the backside of each specimen by using standard etching processes. The test samples need to be preconditioned in an air circulating oven at 135 C for one hour to remove any excess moisture that could lead to premature failures. After preconditioning, the specimens can be held in a desiccator at room temperature. After attaching the sample to the solder float test fixture, float it for 10 sec., foil side down, on the surface of the molten solder at a temperature of 260 C (for method A) or 288 C (for method B). Then remove the sample and tap the edges to remove any excess solder. Thoroughly clean and visually examine the sample for blistering, delamination, or wrinkling. In case more than one material is being qualified and no failures are being observed after testing for 10 sec. or if the goal is to determine the weakest point in the laminate and test to failure, then the authors recommend increasing the solder float time incrementally or repeating the test with the same sample until failures are observed. 12.5.2.3.3 T260 (TMA). Aside from testing materials in solder baths, there is one other technique to verify the thermal resistance of laminates. This test method is described in IPCTM-650, method 2.4.24.1, and is used to determine the time to delamination of laminates and printed boards using a TMA system (see also section 12.5.2.1.1). The sample requirements are identical to the ones for determination of the Tg by TMA. A minimum of two specimens should be tested, which can be taken from random locations of the material. Materials are tested as received; the metal cladding is not removed. The samples are preconditioned for 2 hours at 105 C (221 F), and then cooled down to room temperature in a desiccator. The TMA temperature ramp should start from an initial temperature no higher than 35 C (95 F) at a scan rate of 10 C/min. After the scan reaches the specified isothermal temperature, hold at that temperature (onset) for 60 min. or until failure. The time to delamination is determined as the time from the onset of the isotherm to failure. Failure is defined as any event or deviation of the data plot where the thickness is shown to have irreversibly changed. On occasion, some materials will delaminate before the isotherm is reached. In this case, the temperature at the time of failure is recorded. For epoxy laminates and similar materials, the recommended isothermal temperature is 260 C (500 F). For materials intended for lead-free processing and for polyimides and other high-temperature materials, increasing the isothermal temperature to 288 C (550 F) is recommended. 12.5.3 Electrical Characterization Electrical properties include Dc and Df, surface and volume resistivity, and dielectric strength breakdown.
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