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CHARACTERIZATION TEST PLAN
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Table 12.4 summarizes all of the test procedures.
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TABLE 12.4 Laminate Characterization Test Plan 1. Step Data comparison Material available in production volume Material cost Material data sheet available Unit yes/no $/m2 yes/no Data sheet Test result Test result
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Test method IPC-TM-650, method 2.1.2 & 2.1.5 IPC-TM-650, method 2.4.8 IPC-TM-650, method 2.4.8 IPC-TM-650, method 2.4.23 IPC-TM-650, method 2.4.23 IPC-TM-650, as applicable IPC-TM-650, method 2.3.40 IPC-TM-650, method 2.4.24
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Conditioning As received
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Copper peel strength laminate Condition A Copper peel strength laminate Condition B Solder shock laminate 288 C/10s Solder shock laminate 288 C/60s Glass transition temperature (DSC, TMA, or DMA) Decomposition temperature (Td) Z-axis expansion laminate TMA
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N/mm N/mm Pass/fail Pass/fail C C ppm/ C
As received Solder pot 288 C/10s As received As received As received As received As received
3. Step
Material characterization Dielectric constant (1 MHz) Dielectric constant (1 MHz) Dissipation factor (1 MHz) Dissipation factor (1 MHz) Surface resistance Surface resistance Volume resistance Volume resistance
Unit MW MW MW cm MW cm
Test method IPC-TM-650, method 2.5.5.2 IPC-TM-650, method 2.5.5.2 IPC-TM-650, method 2.5.5.2 IPC-TM-650, method 2.5.5.2 IPC-TM-650, method 2.5.17 IPC-TM-650, method 2.5.17 IPC-TM-650, method 2.5.17 IPC-TM-650, method 2.5.17
Conditioning 24h/23 C/50% 96h/35 C/90% 24h/23 C/50% 96h/35 C/90% 24h/23 C/50% 96h/35 C/90% 24h/23 C/50% 96h/35 C/90%
Data sheet
Test result
LAMINATE QUALIFICATION AND TESTING
TABLE 12.4 Laminate Characterization Test Plan (Continued) Data sheet Test result
3. Step
Material characterization Dielectric withstanding voltage Glass transition temperature (DSC) Glass transition temperature (TMA) Glass transition temperature (DMA) Decomposition temperature Td CTE x,y (a1) CTE x,y (a2) CTE z (a1) CTE z (a2) Water absorption Flammability
Unit V/mil C C C C ppm/K ppm/K ppm/K ppm/K %
Test method IPC-TM-650, method 2.5.6 IPC-TM-650, method 2.4.25C IPC-TM-650, method 2.4.24C IPC-TM-650, method 2.4.24.2 IPC-TM-650, method 2.3.40 IPC-TM-650, method 2.4.41.2 IPC-TM-650, method 2.4.41.2 IPC-TM-650, method 2.4.24 IPC-TM-650, method 2.4.24 IPC-TM-650, method 2.6.2.1 UL-94
Conditioning 48h in 50 C H2O
As received
MANUFACTURABILITY IN THE SHOP
During the qualification of a new material, it is also crucial to run the laminate through the production processes to check whether they are compatible. Table 12.5 summarizes all the steps that are necessary to control. The first process step is innerlayer processing. Here, a change in stiffness of the new laminate material can have a significant impact on the processability in horizontal manufacturing lines. This is especially important for thin cores. A change in the copper quality of the new laminate may impact the adhesion of the innerlayer photoresist and can also affect the copper etch rates. During automatic optical inspection (AOI), it is necessary to verify the contrast between copper circuitry and laminate and adjust the AOI settings if necessary. In case of necessary innerlayer repairs, the settings for the welding process may need adjustment to avoid thermal damage of the laminate and ensure reliable interconnects. The last step during innnerlayer processing is copper blackoxide. Here, it is necessary to verify the compatibility of the employed blackoxide (reduced/nonreduced or alternative) to the base material to obtain a sufficient innerlayer bond strength of the multilayer product. The dimensional stability of the innerlayers must be measured after the multilayer cycle to adjust the innerlayer scaling factors of the new material. The next step after multilayer lamination and edge routing is drilling. A change in the thermomechanical properties of the laminate may impact the quality of the drilled holes, and adjustments to drill speeds or desmear settings may be necessary. After metallization and plating, the adhesion of the copper in the plated through hole as well as reliable contacts to all innerlayers must be verified.
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TABLE 12.5 Summary of Production Steps Compatibility with innerlayer (IL) process steps Preclean Resist lamination Exposure Develop, Etch, Strip Punching IL-Automatic optical inspection IL-Repair/outerlayer (OL)-repair Blackoxide/oxide alternatives Compatibility with multilayer process steps IL drying Lay up Press cycle Edge routing Dimensional stability check Compatibility with process steps from drill to electroless copper Drilling Brush/Pumice/Deburr Desmear/Plasma Desmear/Other E less copper or similar process Compatibility with soldermask process step Compatibility with different finish metallization processes Electroless Ni/Au Immersion Sn Immersion Ag Compatibility with routing process
The adhesion of soldermask may also change as well when a new material is introduced. This is especially critical in combination with any metal finish process steps (such as electroless Ni/immersion Au, immersion Sn, and immersion Ag). In addition to having a negative impact on soldermask adhesion, these processes in combination with new laminates can also lead to nonselective metal plating or skip plating. One of the last manufacturing steps that should be evaluated during the introduction of a new laminate material is board routing and scoring. Here the use of a new base material with changed stiffness or different reinforcement may lead to necessary process adjustments.
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