read barcode scanner in c#.net THE DATA EXCHANGE PROCESS in Software

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THE DATA EXCHANGE PROCESS
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When a printed circuit assembly (PCA) design (layout, routing, and verification) is complete, the board data must be sent to the PCB manufacturer. An output format is chosen to export the data from the computer-aided design (CAD) system. Historically, the output to bare board manufacturing was in Gerber data format and Excellon drill information and was accompanied by some textual readme files. (These files did not contain precise definition of layer stack-up, drill span, or component outlines).These files would be sent or rather, thrown over the wall to the fabricator,
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PRINTED CIRCUITS HANDBOOK
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sometimes without even being checked. When the board reached the assembly stage, the board assembler would receive Gerber images of the outer layers, x, y locations of the components and a BOM file. These methods were recognized as troublesome because errors and lack of communication necessitated many clarification calls, faxes, and e-mails, and slowed down the process. 18.2.1 Assessing Quality of Data Exchange Formats Designers and editors, forced to verify the data after output for correctness and manufacturability, began to work with CAD and computer-aided manufacturing (CAM) tool vendors and industry consortia to develop better formats and methods for data exchange. They sought a data exchange format that was explicit, intelligent, optimized, and bidirectional:
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Explicit There should be no need for guesswork or reverse engineering of design and no need for external files (see Fig. 18.2).
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Top Cu. Layer is a positive signal layer named sigt
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FIGURE 18.2 A CAM system view of a typical six-layer PCA after input from an intelligent format that defines the layers order and characteristics explicitly and unambiguously. If Gerber files were used it would take some time to arrange the layers order and characteristics manually. The example includes the following: Silk screen legend files: sst (for top) and ssb (for bottom) Solder paste stencil aperture layers: spt and spb Solder mask images: smt and smb Outer copper layers: sigt and sigb Second layer: pg2 (power layer, which is negative) Fifth layer: gnd5 (ground layer, which is also negative) Inner circuit layers: sig3 and sig4 Drill layers: drill (through drill layer) and dr3-4 (buried via connecting sig3 and sig4)
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INFORMATION FORMATING AND EXCHANGE
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D A T A I N T E L L I G E N C E
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(All product knowledge) CAD Intelligent exchange! CAM
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D A T A
Data degradation
Limited product BOM, LO
U S E F Reverse engineering! U L N Reverse engineering E includes pad S substitute, S extract netlist, merge CAM LO BOM, etc.
FIGURE 18.3 OEM, CEM, and Fab communication levels. In this figure the y-axis denotes the level of intelligence and the x-axis denotes the data exchange process progression over time. When the formats used carry less design intelligence, it is lost (data degradation). Non-value-added reverse engineering (such as manually rebuilding the board stack-up) is required to rebuild intelligence that is required for manufacturing. If an intelligent exchange format is used, no design data are lost and no reverse engineering is required, resulting in a faster, more accurate, and more efficient process.
Intelligent The format retains CAD information that may help the manufacturer (see Fig. 18.3). Optimized A surface should be represented by a clear outline and not drawn with overlapping vectors (see Fig. 18.4). Bidirectional The format should be inherently capable of passing data back and forth, not just passing them one way.This can be achieved through free viewers, annotations tools, and so on. Other important issues to consider in the context of data exchange are the following:
Accountability Who is responsible if something is misunderstood If the exchange always succeeds, it is easier to differentiate between design and manufacturing errors.
FIGURE 18.4 Optimizing surfaces: (a) a polygon filled by different vector widths; (b) the same polygon as drawn by a pen plotter; (c)the polygon as defined by its external outline. Option c is clearly much more efficient and economical. The outline in (c) is the actual outline of the polygon, whereas (a) and (b) represent approximations.
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