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Data ownership Who can authorize changes If reverse engineering is performed, subtle design changes may be introduced without OEM authorization. Trust Is the supplier an ally to whom all available data are provided, or are some design details withheld to protect intellectual property rights
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The next section details all the data elements that designers and manufacturers need to pass among each other.
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Elements of Data Exchange: Intelligent Design Data The goal of a supply chain is short time to market, high quality, and lowest cost, and achieving this goal requires high clarity, efficient communication, and not just a bare-bones data hand-over. Although a PCB can be manufactured from supplied artworks and drill tapes alone, it is much more efficient to send accurate and verifiable electronic data. The data can include information elements beyond the graphic image and component location information that form the minimum pure design data required for improved manufacturing. Among these elements are:
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Mechanical specifications Component geometry Component tolerances and vendor information Standards that the product has to meet
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Some of the information belongs in an SOW and need not be repeated in the case of an established partnership. Included may be marking instructions, packaging instructions, and information needed to ensure conformance to standards.
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Elements of Data Exchange for Fabrication This section lists the information required for data exchange for fabrication. 18.2.3.1 Minimum Requirements. needed for fabrication:
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These are the minimum required elements of data
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FIGURE 18.5 A layer graphic representing the features of a circuit (or a document) layer represented by computer-readable geometric entities involving x and y coordinates and geometric objects lines,arcs,circles,and so on.
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Layer graphics (see Fig. 18.5) Drill data: locations, spans (for blind and buried vias), tolerances, and plating thickness Board outline and rout information Stack-up requirements (layer order)
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18.2.3.2 Important Additional Information. These elements are important but not absolutely required for fabrication:
Netlist information is required to verify that the graphic and drill data truly represent the design. It is highly advisable always to include netlist data so that the graphics can be verified. Assembly panelization definition is required to deliver multiple PCBs in a ready-to-assemble array form (four or more cell-phone boards can be assembled together due to their small dimensions).
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18.2.3.3 Extra Information. This extra information is not covered by computerized formats, but is useful in fabrication:
Electrical (impedance) and material requirements (solder mask, legend, etc.). (Impedance requirements refer not only to line width and tight tolerances thereof but also the actual impedance value, in ohms, and the frequency and impedance model to use.) Fabrication drawing (extra instructions, dimensions). Type of finish and quality requirements (hot air solder leveling [HASL] versus organic solderability preservative [OSP], solder mask). Packaging and delivery instructions. Testing coupon requirements. These additional information elements can be provided as well:
Design for manufacturing (DFM) analysis results and criteria (for example, spacing criteria and violations thereof) Component placement information, which can help the manufacturer create solder mask clearances that provide a good fit for soldering
Elements of Data Exchange for Assembly This section lists the data elements to consider for assembly processes. 18.2.4.1 Common to Fabrication and Assembly. These elements are common to fabrication and assembly:
Outer layer graphics (for circuit, solder mask, and legend images) Drill information (especially through drills and mechanical drills) Board dimensions and outline Required for Assembly. These elements are required specifically for assembly:
Component placement information, including rotations. BOM and approved vendor list (AVL) information (AVL is not required if parts are supplied by consignment). Mechanical assemblies and their locations (screws, shields and heat sinks, etc.). Board electrical schematics for testing (see Fig. 18.6).This information is usually transferred either as an element of a CAD database or as a human- and machine-readable drawing format (usually as a Hewlett Packard Pen Plotter [HPGL] or Data eXchange Format [DXF] file). (Machine-readable in this context means identification of textual labels for nets (signals) and pin and component names. The computer programs cannot understand the connectivity symbolism of the line drawings within schematic drawings.)
18.2.4.3 Extra information. This extra information, not currently covered by electronic formats, must be read and understood:
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