read barcode scanner in c#.net PRINTED CIRCUITS HANDBOOK in Software

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PRINTED CIRCUITS HANDBOOK
Reading QR Code In None
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Printing QR Code In None
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TABLE 19.13 Assembly Complexity Matrix Defined as an Assembly Report Card
QR Code ISO/IEC18004 Recognizer In None
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QR-Code Generator In Visual C#
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Assembly Factors Assembly process
QR Generator In VS .NET
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Paint QR In VS .NET
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Points 35
QR Code Creation In VB.NET
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European Article Number 13 Printer In None
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A 2-pass IR
Drawing Data Matrix ECC200 In None
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UCC-128 Creation In None
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Points 25
Barcode Generator In None
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Bar Code Drawer In None
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B IR/wave B/S passives
Encoding International Standard Serial Number In None
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Barcode Reader In None
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Points 20
Recognizing EAN-13 Supplement 5 In .NET Framework
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Create Barcode In .NET Framework
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C IR/wave 5 B/S actives
Barcode Encoder In Java
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Recognizing Code 128B In Visual C#
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Points 0
USS Code 39 Encoder In Objective-C
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Recognize GS1-128 In VB.NET
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D IR/wave >5 B/S actives
2-pass IR is lowest-cost process due to low defect/repair level. Maximize SMT content, some PTH OK. Back-side SMT attachment with a wave solder process requires the use of adhesive. Back-side actives have a high defect level when the wave solder process is used. 15 0 hours 12 3 hours in situ 6 6 hours in situ and 3 hours static 0 <6 hours
Stress tests
Stress test is a high-cost process step due to cost of chambers, fixtures, and process time. Stress test can be eliminated by using robust components, design, and process. 10 No high hitters 7 <2 high hitters 4 <4 high hitters 0 >5 high hitters
Parts SPQL
Parts SPQL is the quality level of the parts used in the process (shipped product quality level). High hitters are parts known to have a high defect rate. 9 >98% coverage 6 >95% coverage 3 >90% coverage 0 <90% coverage
ICT digital test coverage
The key to high test coverage is the selection of major components that have built-in testability and a PWB design with 1 test point per net. 9 10 min 6 20 min 95% auto 3 30 min 90% auto 0 >40 min <90% auto
Diagnosability
Effectiveness of diagnostic tools provided by the card designer influences diagnostic time. 6 100% auto 4 2 0
Placement/ insertion
Elimination of manual component placement and insertion reduces process time, defects, and process cost. 6 100% auto 4 Simple bracket 2 Difficult bracket 0 Post-solder assembly
Manual attachment
Simple bracket = <1 min assembly time Difficult bracket = >1 min assembly time Post-solder assembly = manual solder operation 4 Auto assembly and retention and keyed 2 Manual and retention and keyed 1 Manual and retention 0 Manual
Connector selection
Manually inserted connectors that are keyed and have retention reduce defects. Prepackaged SMT connectors that can be automatically placed are considered equivalent to keyed with retention. 3 No handling list violations 2 <3 handling list violations 1 <5 handling list violations 0
Handling damage exposure
>6 handling list
violations
Single inline packages (SIPs) > 0.5 in high Memory SIMM connectors with plastic latches Unshrouded headers over 0.5 in high 3 100% auto 2 90% auto 1 <90% auto 0 <90% auto and
Repair
difficult
Auto repair refers to the use of semiautomated repair tools for the removal of large components and connectors. A difficult repair is one that takes >10 min.
PLANNING FOR DESIGN, FABRICATION, AND ASSEMBLY
38 IBM PS 2 ELECTRONIC CARDS 97
FIGURE 19.17
Improvement in producibility scores as a result of the Assembly Report Card.
REFERENCES
1. General Electric, Review of DFM Principles, Internal DFM Conference Paper, Charlottesville, VI, 1982. 2. Hawiszczak, Robert, Integrating Design for Producibility into a CAE Design Environment, NEPCON EAST, June 1989, pp. 3 14. 3. Seraphim, D. P., Lasky, R.C., and Li, C.Y., Principles of Electronic Packaging, McGraw-Hill, 1989, pp. 39 52. 4. Coors, G., Anderson, P., and Seward, L., A Statistical Approach to Wiring Requirements, Proceedings of International Electronics Packaging Society (IEPS), 1990, pp. 774 783. 5. Ohdaira, H., Yoshida, K., and Sassoka, K., New Polymeric Multilayer and Packaging, Proceedings of Printed Circuit World Conference V, Glasgow, Scotland, reprinted in Circuit World, Vol. 17, No. 12, January 1991. 6. Holden, H., Design Density Index, HP DFM Worksheet, Hewlett Packard, April 1991. 7. IPC-D-275 Task Group, ANSI/IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies, IPC, September 1991, pp. 50 52. 8. Donath, W., Placement and Average Interconnection Lengths of Computer Logic, IEEE Transactions on Circuits and Systems, No. 4, 1979, pp. 272 277. 9. Sutherland, S. and Oestreicher, D., How Big Should a Printed Circuit Board Be IEEE Transactions on Computers, Vol. C-22, No. 5, May 1973, pp. 537 542. 10. Moresco, L., Electronic System Packaging: The Search for Manufacturing the Optimum in a Sea of Constraints, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 13, 1990, pp. 494 508. 11. Holden, H. T., PWB Complexity Factor: CI, IPC Technical Review, March 1986, p.19. 12. STATGRAPHICS, Ver. 2.6, by Statistical Graphics Corp., 2115 East Jefferson St., Rockville, MD 20852, (301) 984 5123. 13. Hume, H., Komm, R., and Garrison, T., IBM, Design Report Card: A Method for Measuring Design for Manufacturability, Surface Mount International Conference, September 1992, pp. 986 991.
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