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Small holes and thick boards result in difficulty during the plating processes and can result in defective products that may or may not pass electrical testing. Plating high-AR holes requires chemistry and process parameter enhancements. Fine PCB profile or cutout tolerances may result in punching/blanking requirements versus routing, or changes in the routing parameters or programming. The location of features on the PCB relative to other features may require alternative materials or process changes to reduce the tolerances. Consistency in the plating process versus selected drilling hole size and plating densities has significant impact on the capability to control hole tolerances. Adjustments to the PCB design, drill hole size selection, or process parameters may be required to produce an acceptable product with tighter tolerances. The multilayer stack-up thicknesses and tolerances, along with the copper thickness and line widths, must match the nominal impedance and the upper-and lower-acceptability limit. Often, various impedances cannot be fabricated on the same layer.
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Material Requirements Determination of the bill of materials is required during the initial analysis of the design. The determination of the BOM and other material-processing requirements will define the manufacturing facility s capability to produce and its material cost structure. In addition, the definition of the material requirements will be the basis for the generation of the process traveler requirements. The primary materials requiring definition are those included in the BOM, including laminates, prepregs, copper foil, solder mask, and gold. The materials may be explicitly defined by the PCB customer (e.g., usage of a specific solder mask),or may be implied in the drawings or specifications provided with the tooling package. Several factors impact the selection of the raw materials, including the following:
Customer-defined physical constraints, for example, the definition of the physical dimensions between conductive layers Customer specification of electrical properties, for example, the definition of the impedance requirements on certain layers Manufacturing process capabilities related to lamination thicknesses and tolerances Specification of material dielectric requirements, for example, the usage of FR-4 or polyimide Specifications of physical operating parameters, for example, the minimum requirements of the glass transition temperature The determination of the laminates, prepregs, and copper foils are based on the following:
Standard constructions for the PCB manufacturer of a defined PCB layer count, final thickness, copper weight, and dielectric spacing.
MANUFACTURING INFORMATION, DOCUMENTATION
Custom constructions based on defined physical constraints (e.g., minimum dielectric spacing). These custom constructions are defined through knowledge of the lamination pressing thickness of materials versus copper circuitry densities and the availability of materials from suppliers. Custom constructions based on defined electrical property constraints, such as controlled impedances, cross-talk, or capacitance. These custom constructions are typically defined via equations or software models provided with certain product parameters.
The determination of solder mask is based on the customer specifications and drawings. Once the acceptability of the solder masks is defined, the PCB manufacturer selects the acceptable masks based on either preferred process (due to volume or cost) or the design characteristics interaction with the solder mask. These design characteristics include the following:
Tenting or plugging of vias A hole plugging epoxy may be preferred over liquid photoimageable solder mask with a secondary via plugging process. Platable area densities/higher external copper weights Thin solder masks may not be able to ensure coverage of high plating. Secondary processes Post-solder-mask processes may chemically or mechanically alter the appearance of certain solder masks.
The determination of gold requirements is based on the thickness and area of the gold. These factors can be used to calculate the requirement of gold per PCB product. 20.3.3 Process Requirements The selection of the proper product routing (or traveler) is critical to the upfront analysis of the product acceptability to manufacturing. Considering a typical multilayer PCB product, the product routings can be broken into two parts: the innerlayer pieces and the outerlayer piece. The product routings of the innerlayer pieces are fairly standard, and are typically as follows: Step Layer cleaning Imaging Develop-etch-strip (DES) Innerlayer inspection Oxide Typical process requirements Cleaning of the laminate surface via either mechanical or chemical cleaning processes Coating of the laminate with photoresist material and the exposure of the photoresist with artwork defining the innerlayer pattern Developing of the photoresist, etching of the exposed copper, and stripping of the remaining photoresist Inspection of the innerlayer piece to the PCB design intent Coating of the innerlayer piece with an oxide layer prior to lamination
One of the few decision points in innerlayer manufacturing is whether the product will require inspection. This decision can be based on the manufacturing facility s process capabilities and the design of the specific innerlayer piece. For example, if the process capability for innerlayer manufacturing of designs at 0.008 in. lines and spaces is 100 percent yield, and the product has been designed at or above 0.008 in. lines and spaces, then the product may not require inspection. Typically, the design package will identify the design technologies (e.g., line width and spacing); however, these should be confirmed during the design analysis and review stage. The product routings of the outerlayer pieces define the finished product appearance and, as a result, are more complex. Assuming a pattern plating process, the typical outerlayer
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