read barcode scanner in c#.net Material utilization Process-specific constraints Process limitations in Software

Creating QR in Software Material utilization Process-specific constraints Process limitations

Material utilization Process-specific constraints Process limitations
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All of these factors impact the selection of the manufacturing panel size and the profitability of the product. 20.3.5.1 Material Utilization. The material manufacturing costs, which correspond to 30 to 40 percent of total costs, are directly related to the square inches of material processed. The material costs can include the following: laminate, prepreg, copper foil, solder mask, photoresists, drill bits, chemicals, and so on. Generally, these materials are consumed relative to the panel area manufactured.
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FIGURE 20.5 Stack-up drawing to define thickness, layer order, and tolerances for a multilayer.
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The appropriate manufacturing panel size (see Fig. 20.7) should be selected such that the shippable product consumes the highest percentage of the manufactured panel as possible, thus reducing waste material and product costs. During the design phase of the PCB, the board profile is defined. If the profile s design results in poor manufacturing panel utilization, it will significantly impact the cost of the product. When defining the PCB board profile, the PCB designer should ask the manufacturing site to provide
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PRIMARY (Component) Side Plating layer and thickness Copper foil thickness, layer_1 reference and name Prepreg layer finished thickness and tolerance Copper foil thickness, layer_2 reference and name Copper-clad-core thickness and tolerance Copper foil thickness, layer_3 reference and name Prepreg layer finished thickness and tolerance : continue with stackup Prepreg layer finished thickness and tolerance Copper foil thickness, layer_N reference and name Plating layer and thickness SECONDARY (Solder)
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FIGURE 20.6 Stack-up code listing.
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MANUFACTURING INFORMATION, DOCUMENTATION
FIGURE 20.7 Selection of the best panel to increase the material utilization of the shippable product.
DFM feedback. Oddly shaped PCB profiles can still result in good material utilization, through nesting of the PCB on the panel. General limitations in the selection of appropriate panel sizes include the following: minimum spacing between products for depanelization processes (typically 0.100 in.) and minimum panel border-to-product spacing to permit tooling and registration systems (typically 1.0 in.). In Asia, minimizing materials to minimize costs plays a much more important role than in North America or Europe, where rapid turnaround time may be the singular focus. Table 20.1 shows a typical set of multilayer panel sizes for a large Asian PCB manufacturer.
TABLE 20.1 Typical Multilayer Panel Sizes for a PCB Panel size (inches) 12 14 12 16 12 20 13 16 13 20 14 16 14 20 14 21 14 22 14 23 14 24 16 20 16 21 16 22 16 23 16 24 17 14 18 14 18 16 18 20 18 22 18 23 18 24 12 18 16 18 Useable area (with soldermask) 10.2 12.2 10.2 14.2 10.2 18.2 11.2 14.2 11.2 18.2 12.2 14.2 12.2 18.2 12.2 19.2 12.2 20.2 12.2 21.2 12.2 22.2 14.2 18.2 14.2 19.2 14.2 20.2 14.2 21.2 14.2 22.2 15.2 12.2 16.2 12.2 16.2 14.2 16.2 18.2 16.2 20.2 16.2 21.2 16.2 22.2 10.0 16.0 14.0 16.0
Type Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Standard Chip packaging HDI-microvia Optional
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20.3.5.2 Product Process-Specific Constraints. In the selection of manufacturing panel sizes, there may be processing constraints that restrict the usage of specific panels or limit the method of placing the shippable product on the panel. For example, the manufacturing of products with gold tab plating may require additional spacing between products and restrictions on the rotation and nesting of products. These constraints may force the usage of panel sizes below the optimal material utilization. 20.3.5.3 Process Limitations. Process limitations may require the usage of nonoptimal panel sizes. For example, due to a product s registration requirements, additional tooling may be required, thus reducing the available area for shippable product and reducing the material utilization. Another example is the limitations of some processes to permit larger panel sizes due to the physical processing constraints of the equipment. The panelization process results in the placement of the PCB single images in the locations defined in the panelization definition step during the initial design review. In addition to the placement of the PCB single images and rotated/nested images (Fig. 20.8), the following features may be added to the panel for manufacturing.
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