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TABLE 20.4 Design Rule Checking DRC item Drill layer duplicate coordinates Minimum drill hole-tohole spacing NPTH-to-board edge minimum spacing Purpose of checking Duplicate drill holes consume manufacturing capacity and may result in broken drill bits. Drill holes too close together may result in broken material between the holes. Drill holes too close to the board edge may result in broken material at the board edge. Missing holes may result in nonfunctional designs or products that cannot be used due to missing mounting or tooling holes. Extra drill holes could result in nonfunctional designs due to cutting of traces or shorts (if the holes become plated). Routing cuts leaving minimal material may result in fractured or broken material between routing. Tolerances of the routing operation may result in copper exposed at the edges of the product. Most customer specifications define the minimum acceptable annular ring on PCB products. Annular ring is dependent on the design and the registration tolerances of the manufacturing processes. In addition to feature spacing and potential shorts, pad spacing affects the capability to test products electrically. Feature spacing below manufacturing capabilities could result in shorts and poor product yields. Feature spacing below manufacturing capabilities could result in shorts and poor product yields. NPTH locations too close together may prevent proper tenting of holes and require secondary drilling operations. NPTH too close together may result in damaged features (e.g., cut traces). Line widths below manufacturing capabilities could result in poor product yields. Method of checking Most PCB CAM systems have an explicit check for this problem, provided a given radius of tolerance. Most PCB CAM systems have an explicit feature spacing check. Merge the routing profile onto a copy of the NPTH layer and execute a spacing check of the pad to trace (the route layer would appear as a trace). Check the pad registration against a circuit reference layer, and verify pads without PTH holes. Check the pad registration against a circuit reference layer, and verify PTH holes without pads. Check the feature spacing of the routing layer as a design layer, without considering electrical connectivity. Check the feature spacing of the routing layer as a design layer against the circuitry layer. Most PCB CAM systems have an explicit annular ring check.
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Board edge-to-board edge minimum spacing Copper-to-board edge minimum spacing Minimum annular ring
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Minimum pad-to-pad spacing Minimum pad-to-track spacing Minimum track-to-track spacing Copper-to-NPTH minimum spacing
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Most PCB CAM systems have an explicit feature-to-feature spacing check. Most PCB CAM systems have an explicit feature-to-feature spacing check. Most PCB CAM systems have an explicit feature-to-feature spacing check. Check the feature minimum spacing against a copy of the design layer merged with the NPTH layers. Some PCB CAM systems have an explicit check for this problem; others may require review of the apertures used and highlighting of the apertures for visual inspection. Most PCB CAM systems have an explicit check for this problem.
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Although this may be the design s intent, missing pads may be the result of poor design information or loading failures. These problems can result in nonfunctional designs. Misaligned padstacks may result in unpredictable annular ring results, incorrect compensations of registration, and product scrap.
Most PCB CAM systems have an explicit pad registration check.
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TABLE 20.4 Design Rule Checking (Continued) DRC item Minimum solder mask pad clearance Purpose of checking Solder mask pad clearances below manufacturing capabilities could result in solder mask on the pads and poor product yields. Solder mask edge to feature spacing below manufacturing capabilities could result in exposed features and poor product yields. NPTH solder mask clearances may need to be larger to prevent ghosting of the solder mask from light diffraction through the product mask. PCB edge clearances may need to be larger to prevent ghosting of the solder mask from light diffraction through the product. Solder mask webs below manufacturing capabilities could result in solder mask breakdown and poor product yields. This problem could result in a PCB assembler with solder bridging defects. Spacing below the tolerances of the routing operation may result in exposure of copper at the edges of the product. An annular ring below manufacturing registration and tolerance capabilities could result in open connections and poor product yields. Plane clearances below manufacturing registration and tolerance capabilities could result in shorts and poor product yields Plane layer isolation typically results from either incorrect designs or interpretation of aperture lists; the result is a nonfunctional product. Nomenclature spacing below manufacturing capabilities may result in nomenclature in the hole, due to misregistration or bleeding of the nomenclature ink. Nomenclature spacing below manufacturing capabilities may result in nomenclature on product features, due to misregistration or bleeding of the nomenclature ink. Nomenclature spacing below manufacturing capabilities may result in nomenclature on product features, due to misregistration, bleeding of the nomenclature ink, or skipping of the screen over features, resulting in illegible markings. Nomenclature sizes below manufacturing capabilities could result in illegible nomenclature and poor product yields. Method of checking Check the solder mask layer (as a circuit layer) against the circuitry layer using an annular ring check. Check the feature minimum spacing against a copy of the design layer merged with the solder mask layer. Check the solder mask layer (as a circuit layer) against the NPTH layer, and verify that there are no matches of the NPTH to the solder mask layer. Check the feature minimum spacing against a negative copy of the solder mask layer merged with the routing layer. Use minimum feature-to-feature spacing on the solder mask layer.
Minimum solder mask edge-to-feature spacing Minimum solder mask annular ring for NPTH Solder-mask-to-board edge minimum clearance Solder mask minimum web
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