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Generator QR Code JIS X 0510 in Software Plane-to-board-edge minimum clearance Minimum plane layer annular ring

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Check the feature spacing of the routing layer as a design layer against the plane. Most PCB CAM systems have an explicit annular ring check.
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Most PCB CAM systems have an explicit annular ring check. Most PCB CAM systems have an explicit layer-to-layer isolation check.
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MANUFACTURING INFORMATION, DOCUMENTATION
TABLE 20.5 Physical Artwork Issues Physical artwork issue Acid traps (photo-resist slivers) Pin holes Copper slivers Starved/isolated thermals Soldermask(S/M) slivers (web) S/M to trace spacing S/M coverage Solder bridging Legend on pads Description of issue Small pieces of photo-resist that have minimum adhesion and can break off, resulting in plating or redeposits Small openings in planes or pours that can result in loss of adhesion Small features that may lose adhesion and break off Copper legs for thermals that are cut off from the rest of the plane Small S/M features too tiny to image and adhere properly Small spacings that create S/M slivers Features left open that could result in solder bridging Small gaps between soldered features without S/M that could bridge solder Silkscreen or legend on surface mount technology (SMT) lands Illustration Figure 20.14a
Figure 20.14b Figure. 20.14c Figure 20.14d Figure 20.14e Figure 20.14f Figure 20.14g Figure 20.14h Figure 20.14i
board assembly and to collect design statistical data for quoting, planning, and allocating resources. Each action covers a specific aspect of board assembly, including component location, fiducial coverage, and testability issues. These include but are not limited to the following:
Fiducial analysis SMT component placement needs to align the machine to the individual board. By analyzing global and fine-pitch fiducials, you can identify and correct potential problems. Table 20.6a shows the checklist of a typical analysis.
FIGURE 20.14
Typical producibility problems created in design (physical artwork).
TABLE 20.6 Checklist of various assembly and test analyses that need to be performed in Tooling A. Fiducial analysis Global fiducial summary Local fiducial summary Non uniform local fiducial Fiducial to copper Fiducial to hole Close fiducials Far fiducials Fiducial to like pad Fiducial close to rout Fiducial far from rout Fiducial to background Fiducial to solder mask Fiducial to solder paste Fiducials to silk screen Fiducial to conveyed edge Component center fiducial Component covers fiducial Component local fiducial Component global fiducial B. Component analysis Comp. max height Comp. pitch Comp. rotation Comp. length Min C. Padstack analysis Toeprint to toeprint Extra solder mask web No solder mask web Special toeprints D. Testpoint analysis Toeprint testpoints Via testpoints Other testpoints Testpoint to rout E. Solder paste analysis Solder paste not on SMD pad SMD pad without solder paste Solder paste outside copper Solder paste not exposed by solder mask Solder paste to solder mask Toe distance min (rect. pins) Heel distance mn (rect. pins) Left Distance min (rect. pins) Right distance min (rect. pins) Toe distance max (rect. pins) Heel distance max (rect. pins) Left distance max (rect. pins) Right distance max (rect. pins) Pin area/pad area min Large pin area/pad area min Pin area/pad area max Large pin area/pad area max Pin width/pad pitch Pin Pitch/pad pitch
Comp. length max Comp. Spacing Comp. to toeprint Rout spacing Carrier wall spacing PTH to carrier wall NPTH to carrier wall Via to carrier wall Label to component Assembled board thickness Comp. touch silkscreen Component to conveyed edge SMT component to conveyed edge Other side area keepout Other Side pins keepout
Via to via center Via to via edge Via in SMD Via to toeprint No thieving pad Toeprint to plane Toeprint annular ring Toeprint SM clearance Toeprint to rout Hole in SMD Flow solder orientation Gold fingers to capped via Gold fingers to thru TP Gold fingers to surface TP Gold Fingers to uncapped via
Testpoint to NPTH Testpoint to testpoint Testpoint to toeprint Testpoint to capped via Testpoint wrong shape Testpoint to THMT toeprint Testpoint to tooling hole Testpoint to uncapped via Testpoint to exposed copper Testpoint to unexposed copper Testpoint under component Testpoint to component Testpoint to component angle Testpoint to solder mask Capped testpoint vias
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