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INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
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Size and pitch of components are smaller while the number of I/Os is increasing. Smaller geometries allow faster transmission of signals and reduce signal crossing delay.
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At the same time, enhanced performance is required for faster signal rise times, reduced parasitics, reduction of radio frequency interference (RFI) and electromagnetic interference (EMI), fewer layers, and improved high-temperature performance and reliability. HDI provides all of these advantages and more. 22.2.3 HDI Traditional PCB Comparison The interactions among printed circuit boards, components, and assemblies are best seen by the packaging technology map (see Chap. 2; Fig. 2.2). Components are characterized by the average I/Os per part, assemblies by the components per sq. cm and I/Os per sq. cm, and the printed circuit by its wiring density in cm per sq. cm. Fig. 22.1 shows the approximate crossover between the traditional printed circuit board and the next generation with microvias.4
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FIGURE 22.1 The through-hole density barrier. If the ends of an electrical net contain an SMT pad connected by a trace and a via hole, then there is only so many such connections (using conventional design rules spacing) that can be placed in any square area. This through-hole barrier is shown crossing this technology roadmap. To cross the barrier (and prevent via starvation), the fabricator must stack vias using blind and buried vias and such.
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Design, Cost, and Performance Trade-Offs The HDI structure is cost-effective for higher-density assemblies shown throughout this chapter. The relative price of HDI versus relative density is depicted in Fig. 22.2. Cost parity (for similar wiring densities) is achieved with a four-layer HDI microvia at approximately an eight-layer, through-hole printed circuit multilayer. Wiring capacities and densities greater than an eightlayer multilayer can be achieved at a lower price with a properly designed HDI substrate.At very high densities, there are no through-hole multilayers that can meet the wiring capacities and density demand necessary, whereas HDI can easily meet the requirements.
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FIGURE 22.2 Relative price and density comparison between conventional throughhole (TH) boards and HDI microvia boards with different structures. The relative cost index (RCI) is actual production pricing of boards normalized to the eight-layer price. The density (DEN) is a measure of the maximum average pins (leads) per sq. in. (for both sides of the PCB). The diagonal lines are equivalent density boards. These are for FR-4 printed circuits.
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Specifications and Standards The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has been working on standards and specifications for high-density interconnecting structures. Three standards and a guideline are the documents that are available from the IPC. The four documents are:
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IPC-2315 Design Guide for High Density Interconnecting Structures and Microvias IPC-2226 Design Standard for High Density Interconnecting Structures and Microvias IPC-4104 Standard for Qualification and Conformance of Materials for High Density Interconnection Structures and Microvias IPC-6016 Standard for Qualification and Performance Specification for High Density Interconnection Structures The IPC standards that cover HDI design rules, materials, and specifications are:
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IPC-2226 This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material characterization. It is intended to provide standards for use in the design of printed circuit boards utilizing microvia technologies. IPC-4104 This standard identifies materials used for high-density interconnection structures. A series of specifications (slash sheets) are defined for specific available materials. Each sheet outlines engineering and performance data for materials used to fabricate highdensity interconnecting structures. These materials include dielectric insulator, conductor, and dielectric/conductor combinations. The slash sheets are provided with letters and numbers for identification purposes. For example, if a user wishes to order from a vendor and reference the specification sheet number 1, the number 1 would be substituted for the S
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