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INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
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in the preceding designation example (IPC-4104/1). To start the ordering process, one can use the slash sheets in the IPC-4104 document in combination with relevant IPC documents for each material sets (e.g., IPC-CF-148, IPC-MF-150, IPC-4101, IPC-4102, IPC-4103, etc.). IPC-6016 This document contains the general specifications for high-density substrates not already covered by other IPC documents.
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HDI STRUCTURES
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The IPC HDI Structure Subcommittee, which is responsible for defining performance requirements, used the following methodology to specify HDI products. Since a microvia can be any shape including straight wall, positive or negative taper, or cup determining the methods used for producing microvias can be segmented into three methodologies (A, B, or C), as noted in Table 22.1.
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TABLE 22 .1 Ten Process Methods Utilized to Produce Microvias Hole formation Mechanically drilled Dry-etched (plasma) Mechanically punched Abrasive blast Laser-drilled Post-pierced Photo-formed Insulation displacement Wet-etched Conductive bonding sheets Microvia process* A A A A A B A B, C A C
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* A: create hole, then make conductive; B: create conductive via, then add dielectric; C: create conductive via and dielectric simultaneously.
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All of these technologies provide approximately the same high-density design rules. These design rules endow build-up technologies with four to eight times the wiring density of conventional, all-drilled through-hole vias. The ten via profiles are depicted in Fig. 22.3.
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FIGURE 22.3 Representative microvia profiles and the processes that produce them.
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The structure of the high-density interconnection is by type:Type I,Type II,Type III,Type IV, Type V, and Type VI (see Table 22.2). However, some of these type constructions are based on which microvia material is to be used. Thus, the following definition applies to all high-density interconnect substrates (HDIS).
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TABLE 22.2 Description of the 6 IPC HDI Type Structures of IPC-2226 Type I Type II Type III Type IV Type V Type VI 1[C]0 or 1[C]1, with through-vias from surface to surface 1[C]0 or 1[C]1, with through-vias buried in the core and from surface to surface 2[C] 0, 2 or more HDI layers added to through-via in core or from surface to surface 2[P] 0 where P is a passive substrate with no electrical connecting functions Coreless construction using layer pairs Alternate construction using conductive pastes
[C], printed circuit core; [P], passive substrate core; 0, 1, and 2, number of build-up layers on each side of the core [C] or [P].
The core, defined as [C], can be identified as an A, B, or C type core. Thus, [CA] is a core with internal vias only; redistribution makes contact with the surface. [CB] is core with internal and external (through microvia structures). High-density interconnecting structures make contact with the innerlayers of the core. [CC] is passive core, in which there are no interconnections.
Construction Type I to Type VI constructions currently describe all known HDI build-up structures, but as the technology evolves, new ones are likely to be created. The notation used is as follows: x[C]x where x = 0,1,2,3, etc. (that is, the number of build-up layers on that side of the core) [C] = a standard laminated core of materials, with or without vias of n layers
22.3.1.1 Type I Constructions. This construction (1[C]0 or 1[C]1) describe an HDI in which there are both plated microvias and plated through holes used for interconnection. Type I constructions describe the fabrication of a single microvia layer on either one side (1[C]0) or both sides (1[C]1) of an underlined printed circuit substrate core. The printed circuit core substrate is typically manufactured using conventional printed circuit techniques. The substrate may be rigid or flexible and can have as few as one circuit layer or be as complex as a prefabricated multilayer printed circuit with buried vias. A single layer of dielectric material is then placed on top of the core substrate. Microvias are formed in the dielectric connecting layer 1 to layer 2 and layer n to layer n-1. Through holes are then drilled, connecting layer 1 to layer n. Then the microvias and through holes are metallized or filled with conductive material. Layer 1 and layer n are circuitized and fabrication is completed. Figure 22.4a shows this construction as illustrated in IPC-2226. 22.3.1.2 Type II Constructions. Type II (1[C]0 or 1[C]1 ) has the same HDI layers as Type I. The difference is the core, [C]. Type II allows through vias to be placed in the core before the HDI layers are applied. The processes are the same except for the cores through vias being
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