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Printing QR Code ISO/IEC18004 in Software INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY

INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
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FIGURE 22.4
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IPC-2226 microvia structures from Type I to Type VI.
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filled before the HDI layers are applied. Figure 22.4b shows this construction as illustrated in IPC-2226. 22.3.1.3 Type III Constructions. This construction (2[C]0) describes an HDI in which there are both plated microvias and plated through holes used for interconnection. Type III constructions describe the fabrication of two microvia layers on either one side (2[C]0) or both sides (2[C]2) of an undrilled or drilled printed circuit substrate core. The printed circuit core substrate is typically manufactured using printed circuit techniques. The substrate may be rigid or flexible and have as few as one circuit layer or be as complex as a prefabricated multilayer printed circuit with buried vias. A single layer of dielectric material is then placed on top of the core substrate. Microvias are formed in the dielectric, connecting layer 2 to layer 3 and layer n-1 to layer n-2. This first microvia layer is either metallized or filled with conductive material and then circuitized. A second layer of dielectric material is then placed on top of this circuitized layer and microvias are formed connecting layer 1 to layer 2 and layer n to layer n-1. Through holes are then drilled connecting layer 1 to layer n. The microvias and through holes are then metallized or filled with conductive material. Layer 1 and layer n are circuitized and fabrication is completed. Figure 22.4c.shows this construction as illustrated in IPC-2226. 22.3.1.4 Type IV Constructions. This construction (1[P]0 or 1[P]1 or >2 [P] > 0) describes an HDI in which the build-up layers are used over an existing drilled and plated passive substrate. The printed circuit or metal core substrate is typically manufactured using conventional
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printed circuit techniques. This substrate may be rigid or flexible. Figure 22.4d shows this construction as illustrated in IPC-2226. 22.3.1.5 Type V Constructions. The Type V construction describes an HDI where there is no core. Both plated and conductive paste layer pairs are interconnected through a colamination process. The multilayer is created with an even number of layers (two-sided flex or rigid layer pairs) laminated together at the same time that the interconnections between the even and odd layer are made. This is not a build-up process; it is essentially a single-lamination-parallel process. Figure 22.4e shows this construction as illustrated in IPC-2226. Layer pairs are prepared using conventional processes of etching, plating, drilling, and so on, or by conductive paste processes. The layer pairs are laminated together using B-stage resin systems or some other form of dielectric adhesive into which conductive paste vias have been placed. 22.3.1.6 Type VI Constructions. Type VI describes constructions of HDI in which the electrical interconnections and wiring can be formed simultaneously. Another variety forms the electrical interconnections and the mechanical structure simultaneously. The layers may be formed sequentially or co-laminated. The conductive interconnect may be formed by means other than electroplating, such as anisotropic films/pastes, conductive pastes, dielectric piercing posts, and so on. Figure 22.4f shows this construction as illustrated in IPC-2226.
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Design Rules The designer should be aware that not all fabricators have equal capabilities in the areas of fine-pitch imaging, etching, layer-to-layer alignment, via formation, and plating. For this reason, the HDI design guide categorizes design rules into two categories: the preferred producibility range and the reduced producibility range. For simplicity of design, this Handbook will further divide the design rules into three category ranges: A, B, and C, with A being the easiest to produce and C being the most difficult. If more stringent design standards are selected, the number of fabricators that can produce such a board is limited. Circuits produced with design rules in the A category will be easier to produce, will have higher yields, and therefore can be fabricated at lower cost. To keep costs at a minimum, you should select the design rules most appropriate for the application:
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Category A This specification allows conventional HDI processes to be used with relaxed tolerances. It should have the highest yield and lowest cost. It is estimated that 100 percent of HDI fabricators can meet these design rules. Category B This is the conventional HDI process. It is estimated that 75 percent of HDI suppliers can meet these design requirements under production conditions. Category C Top-level fabrication shops, representing 20 percent of the total HDI fabricators, can meet these design rules. Panel sizes are often reduced to increase yield, which increases the final cost. Production volumes are presently limited, with special attention required during the production process. These rules require smaller panels and more exotic fabrication techniques. They are generally required only in electronic packages, chip-onboard (COB), flip-chip interposers, or MCM applications. At present, yields are lower and costs are high. It is estimated that fewer than 20 percent of all fabricators can achieve these design rules in limited production or prototype volumes.
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Typical HDI design rules are given in Fig. 22.5. This figure bridges the two design categories from the specification IPC-2226, Design Standards for HDI and Microvias. 5 This is a Type III HDI structure.
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