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FIGURE 22.13 Impact of copper and resin content on in-plane CTE. (Source: DuPont.)
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pressing cycle. Thus, these thin innerlayers can be processed in parallel. Aramid-reinforced material is a cost-effective alternative when laser hole formation is used to form single- and multiple-layer interconnects, and is compatible with FR-4 materials used in the core of aramid FR-4 mixed constructions. Laser drilling of stepped microvia holes is accomplished in one subsequent operation (see Fig. 22.14). This allows the designer to interconnect up to four layers on each side of the inner core without sequential processing a substantial productivity advantage for the PWB fabricator that results in the lowest possible manufacturing cost. See IPC-4104 specification sheets 5 and 23 for more complete material performance information.
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FIGURE 22.14 Photos of conventional and skip-microvias laser-drilled in Thermount materials. (Courtesy of DuPont.)
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Via Filling The demand for filling of through holes with epoxy resin or conductive paste has been rising ever since surface-mount technology became widely adopted in the PWB industry.
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INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
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22.5.3.1 Basics. Following are the traditional examples of the types of applications that require via filling processing capability:
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Preventing acid residue from attacking the Cu plating at the through-hole opening, which can in turn cause an open circuit Averting mishandling due to loss of vacuum during board-level assembly or during vacuumassisted transport in production Avoiding blowout of flux and/or solvent residue during assembly and solder reflow Stopping flux from dripping from the through holes to the opposite side of the PWB Keeping solder resist ink from migrating into through holes during screen printing, which can cause formation of nodules at the through-hole opening during solder plating and/or gold plating Enhancing the planarity of solder resist on the surface of filled through holes and the planarity of core layer for SBU PWBs Improving the stability of solder paste printing volume for via-in-pad designs Preventing the migration of solder into through holes in via-in-pad designs
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The filling of through holes with nonconductive resin and conductive materials using dispensing, screen-printing, and roll-coating methods has been extensively evaluated and tested. Of the three basic methods described earlier, screen printing is the most common process. It allows for efficient, selective filling of large numbers of through holes. 22.5.3.2 Via-Filling Materials. Selection of the proper resin-based material is the most important objective when using a screen-printing process to fill through-hole vias in build-up multilayer cores. In particular, the primary issues to be considered when choosing an appropriate fill material are:
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Ease of printing Ease of grinding (planarizing) Adhesion to hole wall and panel surface
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The most commonly used materials for permanently filling through holes include singlecure (thermal) resins, photoimageable dielectrics, conductive pastes, and the dual-cure (UV + thermal) epoxy resin utilized in the Noda screen flat plug process. Following are brief descriptions and comparisons of the characteristics of each of these types of via-fill materials. 22.5.3.2.1 Conventional Prepregs and RCC. In fabricating a base core with a pattern, the core panel is usually panel-plated and the pattern is made with a dry-film tenting process. Some fabricators seem to prefer pattern plating, however. The choice depends on the fabricator s familiarity with these processes. After the pattern is formed, dielectric material is laminated over the core (in the case of prepreg, with copper foil) and the holes can be filled with resins, depending on the plated hole diameter and the thickness of the core. It is generally agreed that when the diameter of plated holes is equal to or less than 0.3 mm and the core thickness is equal to 0.6 mm or less, these holes can be filled effectively by the lamination process (although the resin thickness of 80 m is preferred in the case of RCC). See Fig. 22.15. When the diameter/thickness conditions are not met, it is necessary to fill the holes using a separate process. A screening process does this from one side of the panel with polyester screen with an oversized hole pattern. After hole filling and curing the resin completely, the fabricator removes excess resin using a belt sander (#600 to #800) or a ceramic brush. Figure 22.16 illustrates the process.This is a tricky but necessary operation for microvia board makers, particularly for photovia processing. Hole filling is costly but yields a few advantages over simultaneous hole filling by lamination of RCC or prepreg. The edge of the plated holes is well protected; therefore, forming
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