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FIGURE 22.15 Conditions under which the through hole can be filled with resin by RCC lamination.
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FIGURE 22.16
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Hole filling and surface scrubbing.
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finer annular rings on the base core by tenting is easier. There is no concavity problem over the hole that can cause difficulties in later processes. 22.5.3.2.2 Dual-Cure (UV + Thermal) Epoxy Resin. The main purpose for using a dualcure epoxy resin is the stability of the B-cured material and the ease with which it can be removed by grinding during planarization. A homogeneous, semicured state can be reached because the liquid environment within the UV exposure system helps to control the temperature and stabilize the intensity of UV light. Furthermore, because the temperature of the liquid environment is kept low, the expansion of air bubbles that may have been trapped in the fill material at room temperature is prevented.
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In formulating epoxy resin via-fill ink, one must consider the adhesion between the fill material and the copper plating in the hole barrel. Normally it may seem suitable to use a material that does not include an acrylic component. However, some suppliers have found it more beneficial to add an acrylic component because of its resistance to moisture absorption. They determined that it would be preferable to improve the ink s adhesion to copper by pretreatment with a black oxide or chemical etching process.This is similar to the approach taken by many dielectric suppliers. 22.5.3.2.3 Photoimageable Dielectrics. An advantage of a dielectric being photoimageable is that unwanted material is washed off during development, thus eliminating the planarization step. Typically, one screen pass is sufficient to fill or plug vias, but two passes can also be used to maximize hole filling. Standard screen-printing equipment is needed with a bed-of-nails or dimple plate to maximize air release out of the plugged holes. If a squeegee is being used, single-sided application is recommended. Two coats are recommended to minimize the effects of material. Cores as small or smaller than 0.030 in. (0.76 mm) require a secondary coating application. 22.5.3.2.4 Conductive Paste. In addition to the previous advantages of via filling stated earlier, conductive via fills also dissipate heat, increase electrical conductivity in the hole, and allow a via-in-pad design option (Fig. 22.17). The latter advantage is another way to recover real estate.
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FIGURE 22.17 A via-in-pad option with conductive via fill: (a) traditional dog-bone design; (b) via-in-pad design. (Courtesy of DuPont.)
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One example is a screen-printable paste made of silver, copper, and epoxy. The optimum mix of metal particle shapes and sizes bonded together with epoxy resin produces essentially zero shrinkage. In general, the plated or unplated through hole is filled with paste using a stencil-printing process. After drying and curing, the plugged through holes are planarized and plated to make them solderable. Some typical design rules are an aspect ratio of 1:1 to 6:1 with vacuum assist, a via size of 6 to 25 mil (152 to 635 mm), and a core thickness of 6 to 85 mil (152 to 2159 m). The product is extremely reliable during assembly. 22.5.3.2.5 Single-Cure (Thermal) Resin. Typically, thermally cured resins exhibit good adhesion strength to copper. Unfortunately, the rate of heat dissipation throughout the filled core material is unstable, making it difficult to achieve a reliable semicured state prior to planarization. As a result, a rapid and unpredictable rise in temperature is likely to occur; as such, it is imperative to fill the holes completely, leaving no voids, if this type of material is to be used. 22.5.3.2.6 Solder Mask Ink. Using this type of material, it is relatively easy to fill the hole. However, the presence of volatile elements (solvents) and the degree of shrinkage during curing have a significant effect on the stability of the manufacturing process. In the case of small diameter through holes, the solvent residue may remain in craters or dishes at the mouth of the hole opening. Furthermore, the copper adhesion strength of these materials is typically lower than that of other hole fill materials.
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