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FIGURE 22.18 Standard HDI manufacturing processes: (a) a typical photovia process with liquid resin dielectric; (b) the standard plasma via process with RCC; (c) the semiconformal laser via process; (d) the standard conductive (paste) solid via process; (e) the insulation displacement via formation process.
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Plasma Via Process Plasma via processing was developed by a Swiss PWB maker, Dyconex. Products made with the plasma via process are called DYCOstrate. There are many variations to the plasma via process, one of which is illustrated in Fig. 22.18b. Today, it is mainly used to fabricate sophisticated flex and flex-rigid wiring boards in small quantities. First, an opening or window is made through copper foil by a normal etching process. When plasma etching is applied through this window, the shape of holes tends to be like a bowl (as shown in Fig. 22.28b), which is not suitable for reliable plating (although new plasmaetching equipment claims to have solved this problem).7,8 Another problem is related to how the microvia hole is formed. The copper edge of the window hangs out over the hole, which results in poor reliability after panel plating. Therefore, to ensure reliable plated holes, a secondary etching is necessary to remove this copper overhang. One good thing results from this secondary etching, however: Since surface copper is thinned, formation of finer conductors is made easier. Nevertheless, by the time the panel is ready for plating for subsequent conductor pattern formation, it takes several times longer than other processes in a mass-production environment. Plasma via processing is effective for forming through holes on flexible materials since holes are formed by plasma etching from both sides of the film and the bowl effect is minimized. Plasma via etching evolved from the traditional process of plasma desmearing of through holes. Different gas, magnetrons, and equipment fixturing are employed by current plasma via-etching equipment. The plasma is generated in a partial vacuum filled with a mixture of oxygen, nitrogen, and chlorofluoro (CF4) gasses. Microwave magnetrons create the plasma field and special low-frequency kilowave units help provide rapid etching of organics.
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Laser Via Process Laser via processing is by far the most popular microvia hole formation process. But it is not the fastest via formation process. In Fig. 22.19, the chemical etching of small vias is the fastest, with an estimated rate of 40,000 to 50,000 vias per second. This is also true of plasma via
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FIGURE 22.19 The various rates of via formation based on diameter and method of via ablation, from chemical, plasma, photo and laser techniques.
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FIGURE 22.20 The wavelengths used by laser via drilling from infrared to ultraviolet region, including the harmonics of Nd:YAG lasers.
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formation and photovia formation. These are all mass-via-formation processes. Laser drilling is one of the oldest microvia generation techniques.9 The wavelengths for laser energy are in the infrared and ultraviolet region. Figure 22.20 shows the five major wavelengths used in current laser drills. The absorption curves of many organic dielectrics epoxy, polyimide, matte copper, and glass fibers are shown in Fig. 22.21. Laser drilling requires programming the beam fluence size and energy. High-fluence beams can cut metal and glass, whereas low-fluence beams cleanly remove organics but leave metals undamaged. A beam spot size as small as approximately 20 microns (<1 mil) is used for high-fluence beams and about 100 microns (4 mil) to 350 microns (14 mil) for low-fluence beams.10,11 However, there are many variations. For the purpose of drilling microvia holes, there are four laser systems: UV/Yag laser, CO2 laser, Yag/CO2, and CO2/CO2 combinations. Then there are three dielectric materials: RCC, resin only (dry-film or liquid resin), and reinforced prepreg. Therefore, the number of ways to make microvia holes by laser systems is driven by the permutation of four laser systems and these three dielectric materials.
FIGURE 22.21 The absorption wavelength of different materials respond to different wavelength of laser energy. Epoxy, copper and glass of laminate are ablated by the UV wavelength but only the resin is ablated by the CO2 wavelengths .
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