barcode scanner in asp.net c# INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY in Software

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INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
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There are several factors to observe in laser via processing: position accuracy of lased holes (microvia holes), uneven diameters of holes, dimensional change of the panel after curing dielectric, dimensional change of the panel due to temperature and humidity variations, alignment accuracy of the photoexposure machine, unstable nature of negative artwork, and so on. These should be carefully monitored and are important for all microvia hole processes. 22.6.3.1 UV/Yag Laser. A Yag laser can penetrate copper; therefore, it is not necessary to pre-etch the window when the choice of dielectric is RCC or a copper-foil/prepreg combination. Positioning accuracy in relation to the capture pad is good, but there are weaknesses associated with the Yag laser. The speed of drilling (ablation) is slower than the CO2 laser, particularly when a hole diameter is equal to or larger than 125 m, because the laser beam is very small. Therefore, it is necessary to do trepanning (spiral drilling pattern), which results in longer drilling time. Another weakness is the Yag laser s sensitivity to the thickness of dielectric material. If the thickness of the RCC s resin is not even, the Yag laser beam, the power of which is adjusted to remove the thicker part of the resin, may damage the capture pad. If adjusted to the thinner part, it may not reach the capture pad. Although the Yag laser can penetrate copper and glass-reinforced prepreg, the situation is worse in this material than with RCC. The laser power must be adjusted to penetrate through the crossover part of woven glass. Then, when the laser beam hits the part of prepreg where there is now a glass bundle (opening), the beam can really damage the capture pad.To avoid this problem, the operator must reduce the laser power and apply laser ablation for a longer duration, which increases drilling time considerably. Depending on the construction of the dielectric layer through which the Yag laser beam must penetrate, the drilling speed must be adjusted to about 3 to 50 holes per second when glass-reinforced dielectric is used. When the dielectric is RCC, the speed of the currently available UV/Yag laser is somewhere around 100 to 300 holes per second. When the dielectric is resin without copper foil, a CO2 laser is the best since a CO2 laser can offer much faster drilling speed (a single-head CO2 laser can drill as many as 25,000 holes per minute, including overhead such as loading a panel onto the drilling table and registering the panel). The best feature of the UV/Yag laser drilling machine is its ability to drill a very small hole (down to 20 to 30 m, whereas the smallest hole a CO2 laser can drill is 50 m in a mass-production environment) and its superior position accuracy through RCC. For higher-speed drilling, even Yag laser users are now etching copper foil down to 6 to 9 m, the process more frequently seen in CO2 drilling. 22.6.3.2 CO2 and Twin CO2. A CO2 laser beam cannot penetrate copper foil unless the foil is very thin, less than 5 m, and the surface is treated to be dark to absorb the CO2 laser beam (this process is called CO2 laser direct drilling and will be treated later). When the surface is resin only, a single-headed CO2 laser machine can drill holes at the rate of 20,000 to 25,000 per minute depending on hole density and distribution. The drilling speed continues to increase. The denser the hole, the faster the drilling speed because time lost by table motion is minimized. A dual-head CO2 machine can boost drilling productivity by about 70 percent compared to a single-head machine. Manufacturers of dielectric resins mix fillers in the resins to enhance peel strength. Some fillers can slow down the drilling speed of a CO2 laser beam (beam absorption is weaker in this case). For example, when the required dielectric thickness is 60 m, resin is coated twice, which is a frequent practice to produce a thick coating. The first coating is made with resin without filler (40 m), and the second coating (20 m) is resin with filler. Since the laser beam goes through a thin layer of filled resin, the speed degradation is minimized. The most desirable shape of drilled microvia holes is tapered, which is accomplished by pulse drilling. Normally, two to three pulses are used. When three pulses are applied on the same spot continuously, the capture pad may be overheated and excessive epoxy smear may result. Therefore, when three pulses are to be applied, the entire panel is drilled first by two
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