barcode scanner in asp.net c# PRINTED CIRCUITS HANDBOOK in Software

Creating Denso QR Bar Code in Software PRINTED CIRCUITS HANDBOOK

PRINTED CIRCUITS HANDBOOK
QR Code Reader In None
Using Barcode Control SDK for Software Control to generate, create, read, scan barcode image in Software applications.
Draw Quick Response Code In None
Using Barcode encoder for Software Control to generate, create QR image in Software applications.
5. H. Holden, Metrics for MCM-L Design, Proceedings of the IPC National Conference on MCM-L, Minneapolis, MN, May 1994. 6. D. Seraphim, Chip-Module-Package Interface, Proceedings of Insulation Conference, Chicago, IL, September 1977, pp. 90 93. 7. H. Charles, Design Rules for Advanced Packaging, Proceedings of ISHM 1993, pp. 301 307. 8. G. Messner, Analysis of the Density and Yield Relationships Leading Toward the Optimal Interconnection Methods, Proceedings of Printed Circuits World Conference VI, San Francisco, CA, May 1993, pp. M 19 1 20.
Recognizing QR In None
Using Barcode decoder for Software Control to read, scan read, scan image in Software applications.
Printing QR In Visual C#.NET
Using Barcode encoder for Visual Studio .NET Control to generate, create QR Code ISO/IEC18004 image in .NET framework applications.
SEMICONDUCTOR PACKAGING TECHNOLOGY
Printing QR Code ISO/IEC18004 In Visual Studio .NET
Using Barcode creator for ASP.NET Control to generate, create QR image in ASP.NET applications.
Draw QR Code ISO/IEC18004 In .NET Framework
Using Barcode creator for .NET Control to generate, create QR-Code image in VS .NET applications.
John W. Stafford
Generating QR Code ISO/IEC18004 In Visual Basic .NET
Using Barcode generation for .NET Control to generate, create QR Code ISO/IEC18004 image in VS .NET applications.
Code 39 Full ASCII Creation In None
Using Barcode drawer for Software Control to generate, create Code 39 Extended image in Software applications.
JWS Consulting PLC, Phoenix, Arizona
Printing Barcode In None
Using Barcode generation for Software Control to generate, create barcode image in Software applications.
Painting Code 128 In None
Using Barcode encoder for Software Control to generate, create Code 128 Code Set C image in Software applications.
3.1 INTRODUCTION
Generate EAN 13 In None
Using Barcode generator for Software Control to generate, create UPC - 13 image in Software applications.
Data Matrix Encoder In None
Using Barcode creation for Software Control to generate, create Data Matrix image in Software applications.
A revolution has occurred in the electronics industry due to advances in semiconductor design and manufacturing, the packaging of semiconductor die, the packaging of electronics systems, and product physical design. The driving force in this revolution originates with the advances that have occurred in integrated circuit (IC) technology and the levels of integration obtained. The initial driver to this was the development of a micrometer-level lithographic capability.1 Semiconductor packaging and printed circuit board (PCB) evolution tracks the advances in IC technology. Figures 3.1 and 3.2 show the trend of chip transistor density and the increase in chip frequency versus time. There is concern that, with the current semiconductor technology advances, by about 2010 we may begin to approach significant process and technology obstacles. As a consequence of being able to put more circuitry on a silicon IC, its package size and the number of package input/output (I/O) pins have increased, as has the wiring density required of the medium that interconnects the packaged ICs. This continuing thrust for higher levels of integration has forced an ongoing effort for smaller and cheaper means of packaging these ICs so they can be interconnected in a costeffective manner that does not degrade the electrical performance of the assembled circuit. As a result, high-performance systems require consideration of both the IC design and its packaged format and the design of the interconnect that connects the ICs. Table 3.1 compares the computing capability available over the years. What has occurred is that there has been a constant increase in functionality (i.e., instructions per second) along with continuous decreases in the cost per instruction. The results of this trend are the ever increasing functionality of portable wireless communications, such as pagers and cellular phones, and their reduction in size to minimum ergonomic standards. Worldwide in 1998 there were some 308 million cell phone subscribers; the number grew to 475 million in 1999. It is estimated that in 2001 there were 1000 million (i.e., 1 billion) cell phone subscribers. From 2000 to 2001, more than half a billion cellular phones were manufactured, and these are now considered a commodity product. This same technology trend is spawning new wireless products for local area networks. These applications will allow cellular
Painting ANSI/AIM ITF 25 In None
Using Barcode creator for Software Control to generate, create ANSI/AIM ITF 25 image in Software applications.
GS1 - 12 Maker In Visual Basic .NET
Using Barcode encoder for .NET framework Control to generate, create UCC - 12 image in .NET applications.
Copyright 2008 by The McGraw-Hill Companies. Click here for terms of use.
Painting UPC-A Supplement 5 In None
Using Barcode generator for Online Control to generate, create UPC-A image in Online applications.
Paint Bar Code In None
Using Barcode creator for Font Control to generate, create barcode image in Font applications.
PRINTED CIRCUITS HANDBOOK
Data Matrix ECC200 Creator In Java
Using Barcode encoder for BIRT reports Control to generate, create DataMatrix image in BIRT reports applications.
GS1 DataBar Expanded Creation In VS .NET
Using Barcode creation for Visual Studio .NET Control to generate, create GS1 DataBar image in .NET applications.
FIGURE 3.1 Chip density trend for logic and DRAM components.
GTIN - 128 Drawer In Java
Using Barcode creator for Java Control to generate, create EAN / UCC - 14 image in Java applications.
Generating Data Matrix 2d Barcode In Java
Using Barcode printer for Java Control to generate, create Data Matrix image in Java applications.
phones, personal computers, etc. to exchange data (including video) using appropriate radio frequency (RF) protocols (Bluetooth operating in the 2.4-GHz frequency range is one such protocol) if they are in proximity to one another. The requirements of the Internet for increasing functionality and bandwidth and lower cost will require new concepts for electronic physical design as well as the incorporation of optical components and interconnects. These trends will continue indefinitely.
FIGURE 3.2
Chip frequency requirement trend.
SEMICONDUC TOR PACKAGING TECHNOLOGY
TABLE 3.1 Cost Comparison Approx. no. of instructions/s 1975 IBM mainframe 1976 Cray 1 1979 Digital VAX 1981 IBM PC 1984 Sun Microsystems 2 1994 Pentium PC
Source:
Price $10,000,000 $20,000,000 $ 200,000 $ 3,000 $ 10,000 $ 3,000
Cents/ instruction 100 12.5 20.0 1.2 1.0 0.0045
10,000,000 160,000,000 1,000,000 250,000 1,000,000 66,000,000
New York Times, April 20, 1994.
Packaging and Printed Circuit Technology Relationships The packaging density trend lines (package area/die area) are summarized in Fig. 3.3. The area efficiencies of array package concepts are evident and have been maintained over a period of 20 years. It is apparent, then, that the trends for new semiconductor chip packaging are increasing the number of package I/Os. Area array packages for high- I/O semiconductors have emerged to minimize package size and enhance package electrical performance (i.e., lower lead inductance).The impact of this will be pressure on PCB fabricators to minimize linewidth and space in order to escape from high- I/O area array packages or direct chip attach (DCA) semiconductors. In 1986, for PCB interconnects, 6-mil lines and spaces were nominal; in 1992, 8-mil lines and spaces were nominal; in 1995, 6-mil lines and spaces were nominal, and in 2000 4-mil lines and spaces are nominal to meet the interconnect requirements of commercial hand-held electronics products. To meet the needs for a finer-pitch circuit board technology for ball grid array (BGA) packages, chip-scale packages (CSPs), and high-density circuit cards, a new circuit board
FIGURE 3.3 Packaging trends show the area efficiency of array package concepts over a period of 20 years.
Copyright © OnBarcode.com . All rights reserved.