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TABLE 23.3 Polymers for Optical Waveguides and Candidate Materials Waveguide optical loss (dB/cm) Manufacturer Allied Signal Dow Chemical DuPont Amoco BF goodrich Gen electric JDSU TeraHertz NTT Asahi Nippon paint Polymer type Halogenated acrylate Acrylate Benzocyclobutene Perfluorocyclobutene Acrylate (Polyguide) Teflon AF Fluorinated polyimide Polynorbornenes Polyetherimide Acrylate Acrylate Halogenated acrylate Polysiloxane Cytop Polysilane-photosensitive Patterning techniques Lithographic, RIE laser Lithographic, RIE laser RIE RIE Lithographic, RIE Lithographic, Lithographic RIE, Laser RIE Lithographic RIE RIE RIE Lithographic Photo bleaching 840 nm 0.01 0.02 0.8 0.01 0.2 1300 nm 0.03 0.2 1.5 0.02 0.6 0.4 0.18 0.24 0.03 0.02 0.17 0.1 0.4 0.07 0.43 0.3 0.06 0.2 0.8 1.7 1550 nm 0.07 0.5 0.03
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FIGURE 23.45 Optical waveguide stack-up in a conventional multilayer prior to lamination. (Courtesy of Terahertz Corporation.)
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1. Sakamoto, Kazunori, Yoshida, Shingo, Fukuoka, Kazuyoshi, and And , Daizo, The Evolution and Continuing Development of ALIVH High-Density Printed Wiring Board, paper presented at IPC Expo 2000; featured in CircuiTree, May 2000. 2. Itou, Motoaki, tp://www.nikkeibp.com/nea/nov99/tech/.
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3. Microvia Substrates: An Enabling Technology for Minimalist Packaging 1998 2008, BPA Group, Ltd., 1999, pp. 4-3 4-17. 4. Tsukada, Yutaka, et al., Surface Laminar Circuit and Flip Chip Attach Packaging, Proc. 7th IMC, 1992. 5. Tsukada, Yutaka, Introduction to Build-Up Printed Wiring Board (in Japanese), Nikkan Kogyo Shinbun, Tokyo, 1998. 6. Holden, Happy, Special Construction Printed Wiring Boards, Printed Circuit Handbook, 4th ed., Clyde F. Coombs, Jr. (ed.), McGraw-Hill, 1995, chap. 4. 7. Takahashi, Akio, Thin Film Laminated Multilayer Wiring Substrate, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 481 484. 8. Shiraishi, Kazuoki, Any Layer IVH Multilayer Printed Wiring Board, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 485 486. 9. Fukuoka, Yoshitaka, New High Density Printed Wiring Board Technology Named B2it, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 475 478. 10. Apol,Tim, Directional Plasma Etching Straight Sidewalls, No Undercut, PC Fabrication, Vol. 20, No.12, December 1997, pp. 38 40. 11. Tsuyama, Koichi, et al., New Multi-Layer Boards Incorporating IVH: HITAVIA, Hitachi Chemical Technical Report, No. 24 (1995-1), 1995, pp. 17 20. 12. Tokyo Ohka company brochure. 13. Holden, Happy, Micro-Via Printed Wiring Boards: The Challenges of the Next Generation of Substrates and Packages, Future Circuits International, pp 76 79, Vol. 1, 1997. 14. Eric, Bogatin, Signal Integrity and HDI Substrates, Board Authority, Vol. 1, No. 2, June 1999, pp. 22 26; a PDF copy is available for download at www.Megatest.com. 15. Figure 12 Integrated 3-D Assembly with Thin-Film, Flip Chip, MEMS and PWB. 16. Erben, Christoph, New Materials in Optoelectronics: Advantages and Challenges for Polymers, Second Optoelectronics Packaging Workshop, Austin, TX, August 21 22, 2001, pp. B1 B22. 17. Schroder, Henning, Photonic and Optical Wiring Advantages and Challenges for Polymers, Second Optoelectronics Packaging Workshop, Austin, TX, August 21 22, 2001, pp.B1 B22. 18. Watsun, Jim, Chip-to-Chip Optical Interconnec Optical Pipedream First Optoelectronics Packaging Workshop, February 21 22, 2001, Austin, TX, pp.B1 B22. 19. Griese, Elmar, Optical Interconnection Technology for PCB Applications. PCB Fab, June 2002, pp. 20 36. 20. Griese, E., Himmler, A., Klimke, K., Koske, A., Kropp, J.-R., Lehmacher, S., Neyer, A., and S llau, W., Self-Ligned Coupling of Optical Transmitter and Receiver Modules to Board-Integrated Multimode Waveguides, Micro- and Nano-Optics for Optical Interconnection and Information Processing, Proceedings of SPIE, Vol. 4455, 2001, M., pp. 243 250. 21. Griese, E., A High-Performance Hybrid Electrical-Optical Interconnection Technology for HighSpeed Electronic Systems, IEEE Transactions Advanced Packaging, Vol. 24, No. 3, August 2001, pp. 375 383. 22. Krabe, D., and Scheel, W., Optical Interconnects by Hot Embossing for Module and PCB technology: The EOCB Approach, Proceedings of 49th Electronics Components & Technology Conference, June 1999, pp. 1164 1166. 23. Krabe, D., Ebling, F., Arndt-Staufenbiel, N., Lang, G., and Scheel, W., New Technology for Electrical/Optical Systems on Module and Board Level: The EOCB Approach, Proceedings of 50th Electronics Components & Technology Conference, May 2000, pp. 970 974.
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