barcode scanner in asp.net c# Peck drilling has some disadvantages. For example, it can cause the in Software

Drawer QR Code in Software Peck drilling has some disadvantages. For example, it can cause the

Peck drilling has some disadvantages. For example, it can cause the
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Increased nail heading Increased smearing Hole wall roughness Increased cycle times
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25.6.1.4.1 Hole Wall Quality. Peck drilling increases the overall cycle time due to the greater number of z-strokes necessary to complete one drilled hole. Nail-heading values tend to be worse for peck drilling due to the certainty that some copper pads will make contact
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PRECISION INTERCONNECT DRILLING
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with the drill bit several times as opposed to making only one contact when using a single drill stroke. Hole wall smearing can also be a problem when peck drilling. The increase in heat caused by drilling the same hole several times can cause the substrate material to become heated to its melting point, which can lead to deposits of resin along the hole wall. A similar effect on hole wall roughness can also be seen. 25.6.1.4.2 Reducing the Effect of Disadvantages. Methods for reducing the negative effects on the hole wall caused by peck drilling include the following:
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Increasing the feed rate decreases the amount of time the drill bit spends in the hole. Minimizing the number of pecks also decreases heat generation and reduces overall drilling cycle time.
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The design of the tool has a major effect on hole wall quality when peck drilling. To decrease heat generation in the hole wall, the manufacturer must reduce the amount of friction caused by the drill bit making contact with the hole wall. To accomplish this reduced friction, the manufacturer can use an undercut tool design, sometimes referred to as a headed drill bit. The undercut tool design decreases the amount of contact by reducing the diameter of the tool, which creates a larger clearance area, consequently decreasing the amount of flute making contact with the hole wall. The undercut tool design reduces the amount of nail heading and smearing caused by peck drilling.
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Pulse Drilling Pulse drilling is designed primarily as a method to reduce problems related to bird nesting, where excess debris builds up and remains attached to the flutes and shanks of the drill bit after it is retracted from the drilled hole. This condition also occurs in specialized drilling processes such as high-aspect-ratio drilling, drilling of test fixture materials, and drilling of abrasive materials used in high-temperature applications. Pulse drilling acts as a chip breaker by driving the z-axis into the material using a short series of steps or pulses. 25.6.2.1 Advantages. Unlike peck drilling, where the tool is retracted completely out of the drilled hole, in pulse drilling the z-axis pauses for milliseconds between each drill stroke while remaining in the drilled hole. This action allows the drill bit to extract debris up the flute before continuing the next stroke. Due to the rapid rate at which debris accumulates, the duration of each pulse must be kept to a minimum, resulting in a decreased infeed rate. To reduce this effect, pulse drilling uses a depth sensor on the drilling machine to detect the top of the stack. Once the top of the stack is detected, the spindle begins the pulse-drilling process. 25.6.2.2 Disadvantages. Pulse drilling increases the amount of heat generated in the hole wall. It should be used only when hole wall quality is not the most significant aspect of the drilling operation.
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INNERLAYER INSPECTION OF MULTILAYER BOARDS
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Innerlayers of multilayer boards can shift during fabrication processes and create poor layerto-layer alignment. During the artwork exposure or fabrication of the multilayer boards, the position of the copper shifts relative to the nominal stacked position. This can create breakout or missing of the copper pads when drilling the interconnection holes.
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Two methods of inspecting the innerlayers of multilayer panels exist. One that has been used for several years is x-ray. This technology has progressed significantly and is widely used.
X-Ray X-ray technology is used to inspect the innerlayers of multilayer PCBs and to verify that the drill pads are located properly. Innerlayer shift is identified easily in an x-ray image, and a simple technique can be used to measure the misalignment accurately. In developing the PCB artwork, a set of stacked pads are located in the coupon area. These are inspected and a bestfit centering is calculated. X-ray inspection also is used to determine movement of each individual layer. In this case, a locating pad with a corresponding layer pad is on each individual layer. The system can measure the distance from the locating to layer pad and determine movement of each layer due to the location of the layer pads. PCBs can be inspected after tooling holes are drilled to verify that they are in the proper locations. In addition, x-ray inspection can be performed after final drilling to verify that the holes are centered within the pads.
Direct Vision Using direct vision technology, the drilling machine opens a conical hole in the board s outer coupon area (or interior if space is available) and physically examines it with the help of an autofocus/autozoom camera at the copper traces exposed by the cut. These traces represent the various layers and can be measured to indicate their x and y variance from nominal. This is done for each internal layer, and algorithms are applied to generate a new drilling program that will provide for a best-fit drilling scenario. 25.7.2.1 Overview. The autofocus/autozoom camera looks at fiducial targets that are a cross pattern of traces spaced larger than the diameter of the tool used to drill the targets. The cross target should be repeated as a pattern shown in Fig. 25.6 to enable multiple depth cuts for thick panels. 25.7.2.2 Process. This pattern should be stacked on each internal layer and placed outside the circuitry. It is recommended that the patterns be as close to the circuitry as possible without interference to gather the best possible layer movement data.
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