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between one or more of the components in the polymeric matrix, reducing the photoresist s solubility in the developing solution. The exposed regions remain after development of the image. For positive-acting photoresists, the chemistry is often the novalac resin-based materials utilized by the semiconductor industry. Upon exposure, an acid-catalyzed reaction occurs that increases the solubility of the photoresist in the developer solution. In this case, it is these exposed regions that are removed in the developer solution. Photographic tone can have an effect on product yield caused by contamination between the phototool with the master image and the photoresist. For a negative-acting photoresist, contamination blocks the light and prevents cross-linking, leading to a mousebite (partial reduction in line width) or an open circuit in the conductor after etching. For a positive-acting photoresist, contamination blocks the light and prevents the acid-catalyzed solubilization, leaving excess metal and a possible short after etching. Since circuit patterns often have a greater area of spaces than lines, there is a lower probability of a contaminant causing an actual defect with the positive-acting photoresist. However, negative-acting photoresists are the most widely used since many other factors impact yield and contamination must be minimized in any photolithographic process.. 26.2.2 Decision Factors The large variety of commercially available photoresists makes it a challenge to determine which one is likely to perform best for a given application. Key technical and economic factors that must be considered are summarized in Fig. 26.3.The primary consideration is the end use of the pattern.
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The photoresist must be chemically compatible with the subsequent pattern transfer steps (i.e., can withstand the chemical environment such as the solution pH) for it to function as an accurate mask for pattern transfer.
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Key Considerations in Photoresist Selection Metallization Process Etching Acid Akaline Plating Copper Tin Tin/Lead Gold Nickel Full-Build Electroless Copper Panel Design Substrate Topography Required Copper Thickness Number and Size of Holes Minimum Feature Sizes Economic Factors Compatibility with Existing Application and Exposure Equipment New Capital Equipment Investment Required Productivity Process Latitude for High Yield Material Cost
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FIGURE 26.3 Criteria for selection of photoresist materials.
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The nature of the substrate itself in terms of topography and surface features must also be considered. Is the photoresist required to cover or tent plated through holes or tooling features, and must it conform to existing circuitry This consideration will dictate if dry-film or liquid photoresists are appropriate and, in some instances, the required tone. The required product feature dimensions are equally important. They are usually specified in terms of line width and spacing with a given allowable variation. Since these product specifications are for the final conductor features, the impact of photoresist processing on the critical dimensions must be established. Each photoresist has an inherent contrast (i.e., the rate of change of solubility on exposure to light). This contrast, combined with the resist thickness, phototool, light source used for exposure, and developing conditions, determines the finest feature that can be imaged. For photoresists used in the PWB industry, the minimum line width achievable in production is usually 10 to 25 mm greater than the photoresist thickness. Novel process sequences have demonstrated it is possible to overcome this traditional barrier.2 The adhesion of the photoresist is another key attribute. The chosen photoresist must have good adhesion to the underlying substrate during pattern transfer but must also be able to release cleanly from the substrate during stripping.
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Dry-film photoresists are generally used for pattern formation prior to both plating and etching. These films have a three-layer structure, with the photosensitive material sandwiched between a polyester coversheet and a polyethylene separator sheet (see Fig. 26.4). The photoresist thickness is typically 25 to 50 mm, but thinner and thicker films are used for special applications. The photoresist is applied to the printed wiring board (PWB) substrate using lamination: The polyethylene separator is removed, and the photoresist flows under the heat and pressure from the laminating rolls to adhere to the substrate. The polyester coversheet
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FIGURE 26.4 Dry-film photoresist components. (Reprinted with permission of DuPont Electronics, DuPont Technical Literature.)
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