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FIGURE 26.8 (Continued)
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Equipment is available to convey even very thin panels. Panels are often heated, wetted (wet lamination), or cleaned before the actual lamination. 26.6.3.2 Dry-Film Vacuum Lamination. This method is similar to hot roll lamination but the temperature and pressure used to adhere the photoresist to the substrate is applied by a heated vacuum platen instead of laminating rolls. Vacuum lamination is useful for products with tall or closely spaced features that make it difficult for the photoresist to conform. The vacuum removes the air that would be trapped and pulls the photoresist into tight spaces, providing conformal coverage. This equipment is also used for material that will deform nonuniformly under the pressure of laminating rolls, such as thin unreinforced polyimides. With vacuum lamination, the pressure is evenly distributed over the panel, improving dimensional stability control. 26.6.3.3 Liquid Coating. A great variety of methods are used to apply liquid photoresist to panels. Roller, spray, electrostatic, and electrophoretic coating provide double-sided application and are well suited to high-volume manufacturing. Curtain coating is single-sided, requiring either two passes of the panel through the equipment with slight drying between coatings or an inline equipment layout with two coating and drying units. This causes a difference in the solvent content of the two sides. Screen-coating equipment is available for either single-side or double-side coating. In all instances, the cleanliness of the surroundings, equipment, and solutions is essential for high-yield processing. Most equipment is designed to minimize material consumption by collecting and filtering excess liquid so it can be recycled to the feed tank. 26.6.3.4 Roller Coating. This method places liquid photoresist on the board by transferring the liquid from one set of rollers to another (see Fig. 26.9). The exact number, physical configuration, and surface of the rollers vary, as well as how the material is metered. Often, gravure roller coating is used. Grooves or crosshatches in the rollers that contact the panel determine the amount of liquid deposited on the substrate and are set with a measured overlap or interference so that the board is squeezed between the rollers.19 Photoresist viscosity also influences the coating thickness applied. Improvements in panel handling and in confining the solution to
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Liquid photoresist (b)
FIGURE 26.9 Configuration of a roll coater: (a) direct coating; (b) indirect coating.
the center of the panel allow for simultaneous two-sided postage stamp coverage similar to that obtained with dry-film photoresists, leaving the tooling and location holes clear of material. In commercial systems, the coater is conveyorized, with panels entering a clean oven immediately after coating. The throughput of these systems can be as high as 240 panels per hour. 26.6.3.5 Spray Coating. Although very thin and uniform coatings are possible with this method, its use in resist imaging has been limited due to concerns about waste caused by overspray. The spray head traverses a larger area than the substrate to be coated, and the amount of liquid photoresist that becomes overspray can be significant. Exact characteristics of the coating in terms of thickness and topographical coverage depend on spray-head configuration, nozzle backpressure, droplet size, and conveyor speed.20 26.6.3.6 Electrostatic Coating. This method is similar to spray coating except that the rotation spray head is charged and the panel is grounded. Since the atomized photoresist is attracted to the substrate, there is less material waste than with spray coating.21 Electrostatic coating is used for solder mask since it provides good coverage of conductor sidewalls. However, its use with photoresist is limited to innerlayers. It is unsuitable for outerlayers because it deposits a thicker coating on the rim of a plated through hole while leaving its interior uncoated. 26.6.3.7 Electrophoretic Coating. This method requires materials specially formulated for anodic or cathodic deposition. The equipment schematic in Fig. 26.10 illustrates the process sequence: preclean, coat, permeate rinse, rinse, and dry.22 Panels are placed in the photoresist solution wet or are often sprayed with solution to ensure wetting, especially if the parts have blind or through vias. Voltage is applied, and within 20 sec. to 3 min. an insulating film forms.
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