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The shapes of the pins are either round or elongated with one flat side. In the latter case, the flat side defines the edge, while round pins center within the hole in the panel and phototool. Film artwork alignment holes are punched with respect to the product pattern by plotting alignment targets as part of the product pattern and optically aligning and punching a slot or hole.The edges of the punched feature wear, and registration will deteriorate with use. For glass artwork, the glass is drilled at the alignment locations and a bushing is placed at the center of the hole. The pin is then inserted through the bushings in top and bottom artwork and through the panel. With use, the bushings do move and must be reset for maximum reproducibility. Optical alignment systems operate either manually or automatically. In both instances, the phototool is plotted with alignment targets usually an opaque dot that is smaller than a drilled or punched hole in the panel. With backlighting, the dot (phototool) is aligned to the center of the hole (product). Often, three locations at the edges of the panel are used. In manual systems, micrometers are used to move either the part or artwork. In automatic equipment, a vision system calculates the necessary movement, and motors then move either the phototool or the product into alignment. Since there is no wear on the phototool, when it is optically registered the accuracy is maintained with usage. The absolute accuracy achieved with optical methods is superior to mechanical registration, with the best accuracy and reproducibility obtained with automatic optical systems. The extra expense for automated equipment is warranted if it is needed to meet stringent product requirements. 26.6.4.1.3 Exposure Control and Measurement. The role of exposure is to change chemically the photoresist and its solubility in the developer solution. The appropriate energy dose is determined experimentally by measuring the combination of dose and development that is needed to produce features with straight sidewalls. The photoresist is coated on an optically clear substrate and exposed from the backside. Contrast curves, plots of the log of the exposure dose versus the thickness of the film remaining, are used to identify the functional cure point for example, the dose that loses thickness less than 10 percent (see Fig. 26.13).
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FIGURE 26.13 Contrast curve for a negative-acting dry-film photoresist, percent film thickness remaining versus exposure dose (mJ/cm2).
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Exposure in the region of stability ensures that the base of the material has reacted. Step wedges, film strips with a series of neutral density filters, are also used to determine appropriate exposure doses. The dose is varied to obtain photoresist residue on the area with the manufacturer s recommended step value. This technique depends on appropriate and consistent developer conditions. Step wedges are often used to control the expose or expose-and-develop processes. The energy incident on the photoresist is the product of the lamp intensity and the time of exposure: energy = intensity time (26.1)
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Thus, the exposure dose can either be measured directly by using an integrating radiometer or indirectly by measuring exposure time and light intensity with a radiometer. The radiometer response must be matched to the spectral output of the light used so that representative measurements are made (see Fig. 26.14). Most exposure equipment provides the option of using either direct energy or time measurement. With a stable light source, both approaches are equally reproducible.
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FIGURE 26.14 Output of Hg/Xe light source and radiometers. (Reprinted with permission of Optical Associates, Inc., Milpitas, California, Technical Literature.)
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26.6.4.1.4 Contact Exposure Tools. This equipment places the phototool and the panel in direct contact and draws a vacuum between the pieces for hard contact. A range of light wavelengths is used, often from a mercury or mercury/xenon light source, which is stable and has a high intensity output at ultraviolet and visible (UV/Vs) wavelengths (see Fig. 26.14). The light is distributed over the area to be exposed by placing the board at a distance from the source, either noncollimated or collimated by the use of optical elements, as shown in Fig. 26.15. Collimation refers to the angle of incidence of the light onto the photoresist, and it is critically important for fine-line images. Defining fine spaces is the challenge for both additive and subtractive conductor formation, and exposure under the opaque areas cannot be tolerated. The lamp intensity for noncollimated sources is greater, and therefore less time is required to expose the panel. Process throughput is noticeably enhanced for photoresists requiring a large dose. In addition to collimation, good contact between the phototool and the panel is the most important factor to control in fine-line formation. Any gap will allow exposure under the
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