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FIGURE 26.15 Configuration of lamp and optics for a collimated contact printer. A noncollimated source is identical except for the collimation lens in the lower left. (Reprinted with permission of Optical Associates, Inc., Milpitas, California,Technical Literature.)
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opaque, resulting in poor linewidth control and reduced resolution. The sensitivity to off-contact exposure varies among photoresists, and newer resists are formulated with increased offcontact latitude.24 Since the lamp s spectral output degrades over time, the lamp must be routinely replaced to maintain a stable photoprocess. The exact frequency for replacement depends on the line and space definition required, but the lamp life is typically 1,000 hours. Failure to replace a lamp can result in it exploding and damaging the optical elements in the exposure unit, which is far more costly than routine maintenance. Noncontact Exposure Equipment. Semiconductor imaging demonstrated the yield limitations in using contact-exposure equipment. Noncontact methods had to be developed to achieve acceptable conductor yield as critical dimensions decreased to 0.18 mm and below. The PWB industry is following this evolution, driven by the increased demand for products with fine features of 25 mm and less. Semiconductor tool concepts cannot be used directly due to important differences between IC and PWB products, namely the physical size of the substrate and features to be imaged and the flatness of the substrate. The key to noncontact methods is the use of appropriate optics for clear image placement in the photoresist (Fig. 26.16), even if the image transfer function has degraded. For PWB applications, this includes the depth of focus to allow for panel warpage and the resolving power, given the contrast of the resist. The following approaches address these concerns and are viable alternatives to contact printing. Proximity Printing. This is the oldest method for off-contact printing and requires no modification to the equipment optics. The phototool is held out of contact from 125 to 500 mm. The image in the photoresist suffers since the distance between the phototool and the part allows exposure under the opaque area and imaging of debris on the phototool. Nevertheless, resolution as fine as 75 mm has been reported for proximity printing with thin coatings of liquid resist.25 Projection Printing. Three approaches are possible for this technique: scanning, stitching, and magnified projection printing. Scanning and stitching evolved from semiconductor
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FIGURE 26.16 printing.
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Image transfer for contact, proximity, and projection
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and MCM-D thin-film technology, where smaller, flatter substrates are used.They require movement of the phototool and/or the substrate during exposure. Magnified projection imaging is unique to the PWB application and has no moving optical components. A schematic of all three systems is given in Fig. 26.17.
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The scanning printer requires the synchronized movement of the part and the phototool during exposure. Precise alignment of the two pieces must be maintained during the motion. Periodic adjustment for flatness is usually required since this equipment has a small depth of focus. For typical PWB formats, a large phototool is needed, requiring expensive glass phototools for their flatness, rigidity, and sharp line definition. This exposure technique has demonstrated high resolution over a large, relatively flat area using a high-contrast resist.26 Few PWB applications exist, but the technique is useful for flat panel display manufacture. Stitcher projection printers are step-and-repeat tools that use a repeating image or stitch together several images. The artwork generation and management in the equipment are complicated, which has hampered these printers widespread use for large panels. The usual active area size as defined by the optics is approximately 6 in. 6 in. Thus, for a standard 18 in. 24 in. panel, 12 artwork changes are required to expose one side. These systems have very high resolving capability and large depth of focus. Again, glass artwork is used, but these smaller plates are easier to generate and use than in a scanning projection printer. The magnified projection imaging concept was first demonstrated in the late 1980s with the SeriFLASH exposure tool, utilizing 436 nm illumination and a 5 in. 5 in. liquid crystal display as the phototool. The image was magnified six times to expose an 18 in. 24 in. panel, but demonstrated photoresist definition was limited to 125 mm since the liquid crystal features were one-sixth of the final conductor width.The equipment was subsequently modified for 365 nm exposure with a glass phototool to improve resolution. Fifty-mm line and 63 mm space resolution has been demonstrated.27 The exposure time required is similar to that of contact exposure equipment. With optimized optics, this may become a high-resolution tool that utilizes conventional photoresist and phototools.
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