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There are additional steps that improve the resist removal in the line channels and the conductor formation yield. Plasma treatment has been used effectively to improve product yield, especially with respect to shorts in a print-and-etch process. In addition, for some aqueousdevelopable dry films, a heat treatment after exposure has improved the space definition, and spaces equal to or smaller than the resist height have been resolved. Thus, these process steps ensure that tight resolution requirements can be met.
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Strip After the pattern transfer has been completed, the photoresist is removed from the substrate using equipment similar to that used for development. The stripping solution swells and dissolves the photoresist, stripping it either in sheets or as small particles. The equipment design must effectively remove and separate the skins. Often, brushes and ultrasonic agitation are added to aid in the resist removal.As with developing, filtration is important to keep the spray nozzles clean and keep fresh solution reaching the panel. For stripper chemistries that oxidize the copper, an antitarnishing agent is often added either to the stripping solution or as part of the rinsing.
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As design features are continually reduced to produce higher-density interconnects, tighter control of every step in the conductor formation process is required to achieve high yield. The maximum possible yield with an etching or plating process depends on the conductor dimensions such as the conductor pitch in terms of line and space, the conductor thickness, and the size and shape of the capture pads around plated through-holes (PTH) and vias.
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Process Sequence: Etching versus Plating Considerations For a specific circuit design, there is often a question of the appropriate process sequence. Although the capabilities of imaging and the pattern transfer step dictate the overall limitations, the decision depends on the unique capabilities of the manufacturing line to be used. Some general considerations can clarify the true issues for most production situations. Photoresist patterning has different constraints for etching and plating. For etching, a thin photoresist is desirable to maximize the etchants attack in the channel developed in the photoresist. Resolution does not limit the process, since very small spaces can be resolved in either liquid or thin dry-film photoresists. The etching process itself is key to conductor formation. Etching the copper from the channel becomes increasingly difficult as feature size is reduced, particularly for thicker metal layers. Therefore, the key criteria defining the capabilities of the print-and-etch process is the minimum space cleared, constrained by the final conductor height and the etchant chemistry and equipment. For pattern plating, the photoresist thickness must be greater than or equal to the final thickness of the conductor, and it must be possible to develop a photoresist channel equal to the final conductor width. As conductor thickness increases, it becomes more challenging to produce channels with a higher aspect ratio. Since photoresist resolution is on the order of its thickness, it would be difficult to resolve smaller than a 38 mm photoresist channel for 25 mm thick plating, irrespective of the final conductor spacing. Thus, the challenge for pattern plating is to resolve and develop fine channels in thicker photoresist materials and then ensure that the plating solution wets the bottom of the narrow photoresist channels. Thus, in choosing the conductor formation process, the thickness of the conductor and the linewidth and spacing are the key parameters. A generalized relationship between them is
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FIGURE 26.21
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Sample plot of manufacturing line process capability to aid in processing sequence decisions.
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found in Fig. 26.21. It is important that this type of plot is known for the production area before the process sequence is determined.
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Line and Space Division for a Fixed Pitch It is common for product designs to have a fixed pitch, whether it refers to the I/Os for direct chip or packaging attachment or to the spacing between PTHs. This space is often divided equally between conductors and spacing. For etching or pattern-plating processes, avoiding their respective resolution limitations can increase the pattern transfer yield. In etching, the etchant undercuts the photoresist and an etch factor is used to obtain straighter sidewalls and improved linewidth control. If lines and spaces are equally allocated in the circuit design, then the photoresist must resolve a smaller space than a line. This is difficult for fine features, except for very thin photoresists. For fine pitch, having a larger space than line will give higher yield. For pattern plating, the spacing in the photoresist is the limiting factor. After pattern transfer, this will become the line. In this instance, equal line and space is more acceptable, but based on the photoresist concerns, a wider final line than space is preferred. At the same time, it is desirable to increase the spacing for reduced incidence of line shorting, which translates to a wider line in the photoresist. The former is usually more important. Therefore, for both processes there is preferably balance between linewidth and spacing.
PTH Capture Pad Size and Shape for Optimum Line Formation Just as the conductor line and spacing can be optimized, the PTH capture pad shape and size can also be altered to increase the yield. The absolute dimension of the feature is dictated by
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