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the placement accuracy of the drilling process and the overall dimensional stability of the product. The feature is sized to ensure that the PTH and conductor are connected. There are varying specifications as to the extent of capture that is required. Feature dimensions above the line would be processed with pattern plating, and those below the line with print and etch. Depending on the direction and magnitude of the dimensional stability and the drill wander and accuracy, the shape required to capture the PTH can be changed.This would reduce the size of this feature in at least one direction. In consequence, the spacing between the line and pad increases. Since this location is a change to the nominal line-to-line spacing, the narrowing of the channel results in shorting between the features in both a print-and-etch process and additive processes. In the former case, it is more difficult to clear the space, and in the latter, the narrower resist width is often underplated. Thus, when possible, an elongated pad will benefit the final conductor yield.
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1. Woznicki,T., Flex Circuit Manufacturing in a Box Printed Circuit Design and Manufacture, February 2006, p. 26. 2. Stoll, R., High Definition Imaging, PC Fab, Vol. 17, No. 6, June 1994, p. 31. 3. Hayes, E., An Overview of Dry Film Imaging Chemistry, PC Fab, May 1988, p. 74. 4. McKeever, M. R., Laser Direct Imaging Trends for the Next Generation of High Performance Resists for Electronic Packaging, Proceedings, S12-1, 2000 IPC Expo and Technical Conference, San Diego, California, 2000. 5. Choi, J. H., Chemistry and Photoresist for Electroless Deposition, presentation at the IPC Spring 1992 Conference, Bal Harbor, Florida. 6. U.S. Patent 5,268,260, November 7, 1993. 7. Sutter, T.C., Liquid Photoresist Systems An Overview, Board Authority supplement to CircuiTree, Vol. 1, No. 3, October 1999, p. 22. 8. Gangei, J., Pushing the Envelope in Innerlayer Primary Imaging, Board Authority supplement to CircuiTree, Vol. 1, No. 3, October 1999, p. 30. 9. Taff, I., and Benron, H., Liquid Photoresist for Thermal Laser Direct Imaging, Board Authority supplement to CircuiTree, Vol. 1, No. 3, October 1999, p. 66. 10. Almond, R.J., Goewey, M. E., and Jobson, B. F., Lowering Innerlayer Fabrication Cost with Liquid Resists, presentation at the IPC Spring 1995 Conference, San Diego, California. 11. Gurian, M., and Ivory, N., Performance Requirements of Primary Liquid Resists, Electronics Packaging and Production, March 1995, p. 49. 12. Murray, J., ED Processes Revisited, PC Fab, May 1992. 13. Nakahara, H., Electrodeposition of Primary Photoresists, Electronic Packaging and Production, February 1992, p. 66. 14. Dietz, K.H., Surface Preparation for Primary Imaging, presentation and paper at the IPC Spring 1992 Conference, Bal Harbor, Florida, p. TP-1025. 15. Moreau, W., Semiconductor Lithography, Plenum Press, New York, 1989, pp. 651 664. 16. Crum, S., Surface Preparation Process Improvements, Electronic Packaging and Production, July 1993, p. 24. 17. Atotech technical information. 18. Yamada, H., Wet Lamination Technology and New Application for Image Transfer, poster presentation at Electronic Circuits World Convention 8, September 1999, Tokyo, Japan. 19. Patel, R., and Benkreira, H., Gravure Roll Coating of Newtonian Liquids, Chemical Engineering Science, Vol. 46, No. 3, 1991, p. 751.
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20. Young, C., The In Line Spray Conformal Coat Process, Proceedings of the Technical Program, NEPCON West 89, Vol. 2, Cahners, Des Plaines, IL, p. 1676. 21. Marks, D., and Lee, T-C., Electrostatic Applications of Resists and Solder Masks, PC Fab, September 1991, p. 100. 22. Dubrava, J., Pai, D., Rychwalski, J., and Steper, J., Development of Novel Positive-Working Electrodeposited Photoresist Process for the Production of High Density Outerlayers, presentation at the IPC Spring 1994 Conference, Boston, Massachusetts. 23. Nguyen, J., Curtain Coating in Soldermask Application, Proceedings of the Technical Program, NEPCON West 89, Vol. 1, Cahners, Des Plaines, IL, p. 869. 24. Cox, S., Wide Exposure Latitude Photoresists and Fine Line PWB Manufacturing, Board Authority supplement to CircuiTree, Vol. 1, No. 3, October 1999, p. 34. 25. W. R. Grace and Co., ACCUTRACE technical information. 26. Muller, H. G., Yuan, Y., and Sheets, R. E., Large Area Fine Line Patterning by Scanning Projection Lithography, IEEE Transactions on Components, Packaging and Manufacturing Technology Part B: Advanced Packaging, Vol. 18, No. 1, 1995, p. 33. 27. Feilchenfeld, N. B., Baron, P. J., Kovacs, R. K., Au, D. T. W., and Rust, R. D., Further Progress with Magnified Image Projection Printing for Fine Conductor Formation, presentation at the IPC Fall 1995 Conference, Providence, Rhode Island. 28. Dietz, K. H., Alternatives to Contact Printing, CircuiTree, Vol. 12, No. 5, May 1999, p. 120. 29. Vaucher, C., Solid or Gas CircuiTree, Vol. 14, No.1, January 2001, pp. 96 97. 30. Stone, D., Use of a Solid State Laser to Expose High Speed LDI Resists in PCB Fabrication, presentation at EPC 2000 Conference, Maastricht, Belgium, October 4, 2000. 31. Siemens news release at IPC Expo 2000, San Diego, California. 32. Kickelhain, J., New Excimer Laser Technology Ultra Fine Lines (15 mm) without Etching, poster presentation at Electronic Circuits World Convention 8, Tokyo, Japan, September 1999. 33. Waxler, S., and Spinzi, S., Direct Imaging Implementation: Real World Case Studies, presentation at IPC Printed Circuit Expo 2000, San Diego, California. 34. Kesler, M., Direct Write for HDI Substrates, presentation at HDI Expo, Phoenix,Arizona, September 2000. 35. Tamkin, J. M., The Impact of HDI on Fine-Line Lithography, Board Authority supplement to CircuiTree, Vol. 1, No. 3, October 1999, p. 59. 36. Liebsch, W., New Dry Film Developments for Laser Direct Imaging, CircuiTree, Vol 19, No. 10, October, 2006, p. 32.
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