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MULTILAYER MATERIALS AND PROCESSING
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TABLE 27.2 Slash Sheet IPC-4104 Series Slash sheet IPC-4104 4104/12 4104/19 4104/20 4104/21 4104/22 4104/23
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Tg ( C) >140 240 180 150 120 240
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Resin system Epoxy Polyphenylene ether Epoxy blend Epoxy blend Epoxy liquid, epoxy coated Epoxy
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Reinforcement N/A N/A N/A N/A N/A Non-woven aramid
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TABLE 27.3 Header Information from Selected Specification Sheets in IPC-4101B IPC-4101 slash sheet /13 /24 /41 /42 /53 /55 /70 /71 /92 /93 /94 /95 /96 /97 /99 /101 /121 /124 /126 /129 Resin system Polyester, vinylester Multifunctional epoxy Multifunctional epoxy Polyimide Polyimide Multifunctional epoxy Cyanate Ester Cyanate Ester Multifunctional epoxy Multifunctional epoxy Multifunctional epoxy Multifunctional epoxy Polyphenylene Ether Multifunctional epoxy Multifunctional epoxy Di-functional epoxy Di-functional epoxy Multifunctional epoxy Multifunctional epoxy Multifunctional epoxy Flame retardant Bromine Bromine Bromine N/A N/A Bromine Bromine Bromine Phosphorus Aluminum hydroxide Phosphorus Aluminum hydroxide Phosphorus Bromine Bromine Bromine Bromine Bromine Bromine Bromine Tg ( C) min. N/A 150 150 200 220 220 150 200 230 230 110 150 110 150 150 200 150 200 175 110 150 110 110 150 170 170 Td ( C) min. Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated Not stated 325 310 310 325 340 340
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Reinforcement Woven E-glass Woven E-glass Woven Aramid Woven E-glass Non-woven Aramid paper Non-woven Aramid paper Woven S2-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass Woven E-glass
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Fillers Inorganic fillers No No With or without No No No No No No No No No Inorganic fillers Inorganic fillers Inorganic fillers No No Inorganic fillers No
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dielectrics between layers must decrease to keep the overall thickness constant. Thinner dielectrics require either lower Dk value material or thinner lines for constant impedance, sometimes both. Low Dk value materials are frequently the enabler to achieve higher layer count PWBs. There are also applications that require higher Dk material. This allows finer lines to achieve a target impedance when dielectric thickness is already established, providing for greater densification. Transmission speed is important because the signal transit time affects device timing and determines at what circuit length transmission line effects become important. The transmission speed of an electromagnetic wave in a dielectric medium is the speed of light divided by the square root of Dk. Air has a Dk of 1.0, and electromagnetic waves travel at the speed of light (12 in./ns). At 1 GHz, standard FR-4 ML-PWB materials have a Dk of 4.4 and the transmission speed is reduced to 5.7 in./ns. With a material having a Dk of 3.4, transmission speeds reach 6.5 in./ns, while even lower Dk materials can achieve speeds up to 8 in./ns. Although these are small improvements, the higher transmission speed provided by a low-Dk material may be important in some high-speed applications. 27.2.2.1.2 Dielectric Loss (Df or Tan d ). The energy absorbed by the dielectric media is called dielectric loss. Attenuation is proportional to tan d and signal frequency. For standard FR-4 ML-PWB materials, tan d is 0.02, which translates into serious losses at frequencies above 1 GHz. For circuits operating above 1 GHz, a lower loss material is required. There are a number of material choices for lower dielectric attenuation, including blended epoxies, hydrocarbon ceramic, polytetrafluoroethylene (PTFE), and PTFE with ceramic. The tan d values of these materials are approximately .01, .004, .002, and .001, respectively. 27.2.2.2 Thermal Properties. The important thermal properties of a laminate are the glass transition temperature, the coefficient of thermal expansion, the time to delamination, and the decomposition temperature.1,2,3 These properties quantify the material s reactions to extreme temperatures and so are indicator s of the materials suitability for a particular reflow profile and residual capacity for withstanding heat input (such as rework or hot use environments). Tg alone is insufficient to predict a materials response to LFA temperatures. In fact, since each test measures a different response to temperature, all the tests together provide a broad determination of suitability to a particular use. 27.2.2.2.1 Glass Transition Temperature (Tg ). The Tg of a resin is the temperature at which the resin reversibly changes from a glassy state to a rubbery state. This loss of modulus creates an effective limit on the operating temperature of the system. Tg also affects the thermal fatigue life of the plated holes in the ML-PWB. Higher values of Tg translate into lower total z-axis expansion, which in turn means less stress on the plated through holes (PTHs), all other variables being held constant. There are three methods that are currently used to evaluate Tg: differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and dynamic mechanical analysis (DMA). Results from the three methods vary since they measure different properties associated with the glass transition. Each has its rationale, strengths, and weaknesses. It is important to note not only the value of Tg given for a particular material, but the method by which the Tg was determined; only then can meaningful comparisons between materials be made. Tg measurement by differential scanning calorimetry (DSC) defines the Tg as a change in the heat capacity of the material. The deflection in the heat rate absorption curve, W/g/ C, is used to identify the second-order thermodynamic change from a glassy solid to an amorphous solid that is the glass transition. DSC is the method most commonly used by laminators for determining, and reporting, the Tg. The sample for DSC weighs between 15 to 25 mg and is tested with copper foil on both sides. This method is well suited to the testing of laminates and provides a precision measure for Tg on cores and cured prepreg (laminated to foils) for the laminator.These results are used for product acceptance and process control. DSC results are generally 5 to 10 C higher than when the test is conducted by TMA.
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