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Panel imaged to specific layer pattern retaining Cap plate over via fill.
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Panel or Pattern plate deposited to form conductive circuit features over via fill. Note: Panel plating increases the overall thickness of copper for final etch.
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IPC 6012 will relax the 0.0005 in. wrap requirement as the industry matures in regard to controlling the planarization process and additional reliability data become available. 27.3.5.5 Via Fill Summary and Additional Considerations. The manufacturing of reliably filled vias should not be underestimated. Considerable process development is required to optimize the interaction of maintaining plating wrap to lower the risk associated with via fill planarization. The nature of reported failures due to compromised interconnect integrity have ranged from infant mortality at assembly to latent field failures. These failure mechanisms are very difficult to screen with standard performance verification methods. Even postassembly environmental stress screening (ESS) may not exercise sufficient stress levels to screen out marginal product effectively. This has directed some users to specify thermal shock temperature cycling at the bare-board production lot level for acceptance testing.This level of lot acceptance becomes more critical for lead-free assembly thermal stress environments, requiring the user to be more cognizant of the fill material selection. A number of commercially available material choices exist with a wide variety of physical properties. Matching a material to a design type is necessary prior to specifying it on a drawing. Industry dialogue indicates the desire eventually to establish a material performance
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specification for fill materials similar to the IPC SM 840 for solder mask. The absence of a material specification requires the user to specify the brand(s) of acceptable fill materials through a user/supplier agreement. The process of specifying a hole-fill material can add considerable cost and difficulty to the PWB manufacturing process. The process labor cost is relatively flat to apply a material, with the most significant cost variable being the material type. Some of the silver-filled conductive materials are roughly twice the cost of nonconductive materials. The added process time and material cost can be roughly estimated at $25 to $50 per panel not including setup fees or minimum lot charges. The impact to reliability is judged to be weighted more toward the suppliers ability to successfully process the panels without degrading plated interconnects rather than the fill material type. This is followed by the ability of the manufacturer to metallize a specific fill material. The greatest number of failures reported in industry have been related to the planarization process. To this end, commercially available planarization equipment has come to the marketplace. Due to the rapid introduction of hole fill and process immaturity, many suppliers were faced with establishing the sanding processes with modified deburr machines or fully manual methods. Even with automatic planarization equipment, careful consideration should be given when specifying via fill for designs with heavy-weight copper or rigid flex constructions. Any construction that lends itself to circuit pattern imprint at the surface will have difficulty in the planarization process. Panel thickness at via structures can often be several mil. thicker than open circuit areas. This change in height is not easily recognized and is problematic for producing a uniform sanding surface.Additionally, some softer materials or non-glassreinforced materials may not be able to be planarized without distortion or gouging. With more designs migrating to higher-density layout schemes, it is expected that the use of via fill will increase. The process of via fill is gaining maturity for Class 3 hardware but this has also been the market segment most affected by reliability issues. Many end users who learned difficult lessons quickly introduced their user-defined specifications for hole fill. Userdefined specifications often do not lend themselves to producible limits, so consideration for via fill should be part of the DFM dialogue during the design layout cycle. The user and supplier must work closely together to understand the impact of specifying hole fill for each design construction method employed.
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