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27.4.4.2.2 Panelization. To gain economies in the manufacturing process, the individual board design is stepped and repeated within the artwork tooling. Panelization is the term used to describe this method. Here the elemental goal is to yield as many parts on one process panel as possible.The CAM software allows manipulation of the single design pattern to place or nest multiples within the confines of the chosen panel dimensions. 27.4.4.2.3 Artwork Generation (Photo-Plotting). Once the design has been formatted into the desired panelization, it is ready to be made into a working phototool. The CAM data are output to a server that converts the data into a language recognizable by the plotting equipment. The plotter exposes the circuit pattern on the film tool. Typically, the film tool is polyester-based with a silver emulsion and is exposed by means of a laser or fiber-optic light source. The resolution of the light source directly affects the ability to image the technology type. Note that when the technology type approaches the feature size of HDI, the use of an alternative approach to phototooling may be employed. This is known as laser direct imaging, and, as the name implies, the image is directly exposed onto the production innerlayer, thereby eliminating the use of a phototool. 27.4.4.2.4 CNC Drilling Routing Tools. The machine communication method commonly employed in the automation of the drilling and routing process is output from the CAM tooling as CNC programs (from the earliest computer numerical control machines, as differentiated from manual or template positioning systems). The front-end tooling software facilitates the organization and optimization of the CNC routine. The routine must match the flow of the technology process steps being produced. When sequential processing is required, the drilling routing data must be broken out into separate routines. When the technology type involves HDI features that require laser drilling, specific tooling accommodations have to be considered to match the discipline of the laser equipment for example, the use of special imaged fiducial targets or a special dot mask aligned to the drill locations. 27.4.4.2.5 Automatic Optical Inspection (AOI). Another aspect of the tooling set is the data configuration to support the automated optical inspection (AOI) process. AOI is considered part of the detailed inspection process. When the AOI equipment supports what is known as CAD reference, the original design data (which were reproduced in the phototool) are now output as a configured file to compare the imaged circuit layer to the original designed circuit (see Chap. 53 for a complete discussion of inspection). 27.4.4.2.6 Electrical Testing. The final aspect of the tooling set is preparation of the electrical design data to support an electrical testing routine. The purpose of the electrical testing within the ML-PWB production process is to verify the integrity of circuit continuity. The electrical data required for the test must be extracted from the circuit pattern unless a separate net list is provided that contains the connectivity. The standard data format for electrical testing is IPC-356. (See also IPC-2515A, Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description [BDTST]. ) Electrical testers can take on many forms, but are generally divided into two major categories, the bed-of-nails and the flying probe. Tooling for a bed-of-nails tester consists of outputting data to manufacture a fixture to accommodate the pins, which make contact with the circuit nets. When a flying probe tester is employed, the net data are fed into the machine, which uses its own software to configure the routine to probe continuity and perform isolation. The chosen method of test tooling requires an examination of the economics based on the volume and technology of the ML-PWB. For small prototype lots required in short cycle times, flying probe may be more suitable than bed-of-nails testing. Although the throughput of a flying probe unit is less than that of a bed-of-nails tester, the flying probe does not require expensive, and time consuming to construct, fixtures. When the technology type involves HDI features, the only alternative is to use a flying probe due to the limitation of the grid spacing in a bed-of-nails tester. High-density test requirements continue to drive flying probe technology. (See Chaps. 54 and 55 for a complete discussion of electrical testing.)
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