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The alternative, collimation, an off-contact printing method, holds the film a small distance above the innerlayer surface and prints with collimated light. The collimated machine uses a high-UV lamp with mirrors to reflect intense light straight down on the innerlayer. This method permits a high degree of automation. Off-contact printing is absolutely necessary for printing wet layers. The disadvantage of off-contact printing is a loss of resolution due to incomplete collimation and a great sensitivity to dust and scratches on the artwork. The other style of printing is referred to as direct imaging, and is the technology of choice where production of high-density line and space features is required. In this process, the electronic data are input into the direct image machine instead of being used to produce a phototool. The direct image, typically output through a laser, is used to expose the image by means of a series of on/off pulses manipulated within an x-y axis. The throughput of this process can be limited by the combination of resist speed (sensitivity) and mechanical positioning of the next panel.
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Develop, Etch, and Strip 27.4.8.1 Developing. All modern innerlayer photoresist materials are aqueous-soluble. This means they develop in a mild caustic solution. Note that resists that use solvent developing are no longer in use due to significant health and environmental concerns. The developing process is easily automated by means of conveying the part through a sprayed caustic solution. The developing solution removes the non-imaged resist, which was not polymerized by the light source. Therefore, in effect, what light sees stays. The quality of the developed image is often quantified by means of a density step chart that was previously exposed. By comparing the step held on both sides of the imaged panel, the fabricator can determine process control. 27.4.8.2 Etching. Etching chemistry is determined by the process flow sequence as outlined in Fig. 27.32. Etching can be classified as print and etch when using processes 1, 2, or 4 and using a cured photoresist as an etch resist. Etching is classified as print-plate-etch when using process 3 employing a sacrificial metal layer as an etch resist. The preferred etch chemistry of the print and etch process is cupric chloride. Cupric chloride is easier to control than the ammoniacal etchant used with finished boards, and it can be easily regenerated. Etching occurs by spray erosion with the highly loaded ( 25 oz./gal.) copper-soluble solution. A high degree of automation is possible in the print-and-etch process. Since there is no plating step, it is possible to feed printed innerlayer panels directly into a conveyorized inline machine that develops the resist, etches the circuits, and strips the resists. These automated machine lines are called develop, etch, strip (DES) and improve productivity by reducing the defects caused by handling. The print-plate-etch process follows the same general methods as used in the finished board steps (see Chap. 29). The use of a metal etch resist requires ammoniacal or acid etch. Resist developing is separated from etching by a plating step, so a stand-alone resist developer is required.
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Inspection Once innerlayer etching is complete, the innerlayer must be inspected. The innerlayer inspection criteria follow industry-adopted performance limits (IPC-600 and the IPC-6000 series). These limits must be confirmed prior to lamination into an expensive multilayer to prevent decreasing yields. Flaws are categorized to reflect processing defects related to laminate materials and circuit definition. Line width and spacing are of primary importance on dense signal layers. In the case of controlled-impedance layers, it may be necessary to gauge line widths. Power and ground layers are less likely to have defects and are sometimes excluded. Most modern circuitry precludes manual visual inspection due to the inability to accurately
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