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film materials. Oxide reduction begins to occur spontaneously above this temperature, reducing adhesion.The use of a thin brown oxide, or a reduced oxide, will reduce the risk of this failure mode. A second problem with polyimide film is that it is soluble in strong caustics, so if the treatment time in the oxidization process is excessive, significant substrate damage can occur. When processing circuits with microfoils having high-density features, the fabricator should reduce processing times because the oxide chemistries can reduce copper thickness. The LFAC laminates are compatible with current brown oxides and reduced copper oxide treatments.The oxide treatment should be kept thin, not exceeding 0.4 mg/cm2.Alternative oxide treatments, such as peroxysulfuric oxide, are strongly preferred for some HF laminates.The cores for ML-PWBs that will be subject to LFA should be post-oxide baked to remove moisture generally 120 C for at least 30 minutes for signal layers and 60 minutes for power/ground layers. 27.4.10.2 Silane-Based Adhesion Promotion (Oxide Alternative Treatments). The silane-based process is an alternative to the copper oxide process. Silane can be used to bond epoxy to other materials. One end of the silane molecule bonds to the epoxy. If the other end of the molecule is modified to bond to the secondary material, the silane can serve as a bridge, greatly enhancing adhesion. It is commonly used in this mode to enhance the adhesion of epoxy to glass. It can be also used to enhance the adhesion of epoxy to copper. This silane process attaches a thin silane layer to the copper surface. In lamination, the active epoxy molecules bond to the silane.This causes it to be a binding layer holding the epoxy to the copper. The objective is to achieve a stable coupling between the silane and the copper. This can be done by precoating the copper with a metal such as tin that reacts with the silane. When properly applied, the silane treatment is very stable and is resistant to chemical attack and delamination. The silane process has the advantage that it can be conveyorized in an inline process system. The major weakness of the process is that silane layers can absorb water and fail in some environments. The proper choice of silane chemistry minimizes the risk.
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Drilling The point at which the drilling process occurs is determined by the ML-PWB sequence chosen. 27.4.11.1 Standard Drilling of Innerlayers. Standard buried via innerlayers are drilled and plated prior to lamination using the same procedures as a finished ML-PWB. Buried via innerlayers are typically thin, and it is easy to drill very small holes. Whereas an 8 mil. hole is difficult to drill and plate in a 62 mil. thick ML-PWB, it is relatively easy in a 5 or 10 mil. thick innerlayer. Some manufacturers report success with holes as small as 4 mil. However, very small bits are expensive and easy to break. Special handling is required to load the bits and the drill machine must be vibration-free with very low run-out. For most ML-PWB shops, 8 mil. is a practical lower limit for mechanically drilled buried and blind vias. At 8 mil. it is generally possible to drill thin layers in stacks up to 100 mil. thick, greatly increasing drill productivity. However, a 10 mil. bit is less costly than an 8 mil. bit, so cost-sensitive products should try to design around a 10 mil. bit lower limit for buried vias. LFAC laminates with fillers can be tougher and more brittle than regular FR-4s requiring different drilling parameters. As an example, the standard FR-4 might be drilled at up to 450 surface feet minute (SFM) with a chip load up to 2.0 mil/rev. and a maximum hit count of 1,500 holes; the LFAC epoxy-fiberglass-comparable laminate might be drilled at up to 350 SFM with a chip load up to 1.5 mil/rev. and a maximum hit count of 1,000 holes. Consult your laminate manufacturer s guidelines or applications engineer. The major challenge in buried via processing is handling. Care must be taken in mechanical operations such as deburring to avoid mechanical damage or distortion. Often a frame is used to stiffen the layer during plating. Blind vias may be fabricated like buried vias and mechanically drilled in a top (or bottom) sub-lamination section prior to full board lamination, or controlled-depth drilling may be used after lamination.
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