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27.5.5.3 B-Stage Cure. In the third part of the cycle, flow has stopped and the resin cure is proceeding. The temperature is held at its maximum value to minimize the time to obtain full cure. For a typical epoxy system, this usually is approximately 180 C for 60 min. LFAC laminates, however, tend to require longer and hotter cure stages: up to 200 C internal temperature for 120 min., and longer for thicker boards. Some materials, such as polyimide, require a significantly higher cure temperature for even longer. 27.5.5.4 Cooldown. The last part of the cycle is the cooldown cycle. In Fig. 27.37, it is suggested that the pressure is released after some cooling has occurred, but before the stack reaches room temperature. In many modern systems, the ML-PWB stack is transferred hot to a low-pressure cooling press. It is important to control the cooling rate to minimize warpage. It is generally desirable to cool through Tg in a stress-free state without any significant thermal gradients present. A properly designed cooling press will meet these conditions. 27.5.6 Critical B-Stage Variables During a typical lamination cycle, the B stage undergoes several significant changes. At the beginning of the cycle, the B stage is a solid with a low cross-link density and a melt temperature near 90 C. As the temperature rises, the B stage melts and becomes a high-viscosity liquid. As the press heats further, the viscosity of the liquid drops. When the B stage begins to cure, viscosity reaches a minimum and begins to rise. The region around the viscosity minimum is called the region of maximum flow. The wider this region and the lower the minimum viscosity, the more flow occurs. Figure 27.38 shows a schematic viscosity curve for a typical cure cycle. In a high-flow B stage, the initial cure level is low. This results in a longer time at temperature before the B-stage viscosity rises due to cure. This is often described as a long gel time. In terms of Fig. 27.38, a high-flow B stage has a low minimum viscosity and a wide region of maximum flow. A low-flow B stage has a higher degree of initial cure and may include flow restrictors to increase the minimum viscosity. High-flow B stages are useful
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FIGURE 27.38
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Typical viscosity curve for B stage during lamination.
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in presses with a high-heating rate where the resin may begin to cure before flow is complete. They give excessive flow if used in a press cycle with a very slow heating rate.
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Single-Ply versus Multiple-Ply B-Stage Fill Considerations For dielectric separations that could be filled by either one thick ply of B stage for instance, style 7628 or by two thinner plies of B stage for instance, style 1080 the fabricator and engineer need to determine which approach is best on a product-by-product basis. Building ML-PCBs with single-ply B-stage fill is common and has the following advantages:
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Costs are reduced significantly when sheets of prepreg are eliminated the main advantage. Z-axis expansion is easier to control since there is usually less resin with a thicker style. Overall thickness has less variation since there are fewer elements in the construction. Single-ply fill allows for overall thickness reduction when two plies of any style are replaced by one ply of the same style or thinner.
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Building with two plies is usually either preferred or required with the following conditions:
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The separation to be filled is between two planes generating a large voltage bias and additional dielectric separation is required to minimize the potential of dielectric withstanding breakdown. The separation to be filled is between two layers having thicker (70 micron) copper foil. In this case, there is frequently insufficient resin in a single ply to encapsulate the features and prevent air bubbles in etched-out regions.
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