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Where high performance and a high level of interconnects are required, MCPs and multichip modules have emerged as one packaging idea that can provide the performance required. In addition, fiberoptic transmitters and receivers are now commercially available to provide high-performance offboard optical interconnects in place of a hard-wired backplane interconnect using standard PCB technology and cabling. These fiberoptic transmitters and receivers generally use hermetic and nonhermetic custom DIP package formats for packaging. With advances in optoelectronic semiconductors, onboard optical interconnects are also being investigated and demonstrated. Reference 12 discusses one such demonstration of onboard optical interconnects where a polyimeric optical waveguide, including branch and cross-circuits, was fabricated in the polyimide dielectric of a multilayer copper polyimide silicon substrate. Optical waveguide technology that is embedded in PCBs is now being developed.
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The NEMI Year 2000 Roadmap13 is a good source of detailed roadmap information for IC packaging, PCB technology, optoelectronics, and so on.
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REFERENCES
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1. D. R. Herriott, R. J. Collier, D. S. Alles, and J. W. Stafford EBES: A Practical Lithographic System, IEEE Transactions on Electron Devices, vol. ED-22, no. 7, July 1975. 2. Ira Deyhimy, Vitesse Semiconductor Corp., Gallium Arsenide Joins the Giants, IEEE Spectrum, February 1995. 3. J. W. Stafford, Chip Carriers Their Application and Future Direction, Proceedings of the International Microelectronics Conference, Anaheim, CA, February 26 28, 1980, New York, June 17 19, 1980. Also published in Electronics Packaging and Production, vol. 20, no. 7, July 1980. 4. Ron Iscoff, Costs to Package Die Will Continue to Rise, Semiconductor International, December 1994, p. 32.
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5. Bruce Freyman and Robert Pennisi, Motorola, Inc., Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging, Proceedings of the 41st Electronics Components Technology Conference, Atlanta, GA, May 1991. 6. Howard Markstein, Pad Array Improves Density, Electronics Packaging and Production, May 1992. 7. Rao R. Tummala and Eugene J. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989. 8. Yutaka Tsukada, Dyuhei Tsuchia, and Yohko Machimoto, IBM Yasu Laboratory, Japan, Surface Laminar Circuit Packaging, Proceedings of the 42nd Electronics Components and Technology Conference, San Diego, CA, May 18 20, 1992. 9. Akiteru Rai, Yoshihisa Dotta, Takashi Nukii, and Tetsuga Ohnishi, Sharp Corporation, Flip Chip COB Technology on PWB, Proceedings of the 7th International Microelectronics Conference, Yokohama, Japan, June 3 5, 1992. 10. C. Becker, R. Brooks, T. Kirby, K. Moore, C. Raleigh, J. Stafford, and K. Wasko, Motorola, Inc., Direct Chip Attach (DCA), the Introduction of a New Packaging Concept for Portable Electronics, Proceedings of the 1993 International Electronics Packaging Conference, San Diego, CA, September 12 15, 1993. 11. William F. Shutler, Alberto Parolo, Stefano Orggioni, and Claudio Dall Ara, Examining Technology Options for System On a Package, Electronics Packaging and Production, September, 2000. 12. K. W. Jelley, G. T. Valliath, and J. W. Stafford, Motorola, Inc., 1 Gbit/s NRZ Chip to Chip Optical Interconnect, IEEE Photonics Technology Letters, vol. 4, no. 10, October 1992. 13. National Electronic Manufacturing Initiative, Inc. (NEMI) Year 2000 Roadmap, NEMI, Herndon, VA, 2000.
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ADVANCED COMPONENT PACKAGING
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Texas Instruments, Inc., Dallas, Texas
Simon Ang, Ph.D.
High Density Electronics Center, Department of Electrical Engineering University of Arkansas, Fayetteville, Arkansas
William Brown, Ph.D.
High Density Electronics Center, Department of Electrical Engineering University of Arkansas, Fayetteville, Arkansas
4.1 INTRODUCTION
Packages that contain electronic devices such as integrated circuits (ICs) must, at a minimum, perform the following four basic functions:
Provide for electrical interconnection (signal, power, and ground) between the various components in the package Offer mechanical, electrical, and environmental protection for the devices it contains Provide sufficient input/output connections to allow fan-out with other parts of the electronic system of which it is a part Provide for dissipation of heat that may be generated by the electronic devices contained within the package when the system is powered
In the simplest terms, an electronic package must provide for circuit support and protection, power distribution, signal distribution, and heat dissipation. These basic requirements must be met if a package contains a single IC, a multiple number of ICs, or a combination of ICs and passive devices.1 Driven by the desire, and need, to make electronic systems smaller, faster, cheaper, and less power hungry, semiconductor technology continues its relentless efforts on increasing component and interconnect density, input/output (I/O) capability, and power dissipation, which, in turn, places increasing demands on packaging technology.2 These advances in ICs drive packaging technology by increasing the number of I/O connections, the operating speeds, and the thermal dissipation requirements. Furthermore, systems packaging interconnections must accommodate passive components required for electromagnetic interference (EMI) reduction, filter circuits, terminations, and impedance matching.3 Consequently, for high-performance ICs,
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