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29. Electroplating
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29.1 29.2 29.3 29.4 29.5 29.6 29.7 29.8 29.9 29.10 29.11 29.12 Introduction / 29.1 Electroplating Basics / 29.1 High-Aspect Ratio Hole and Microvia Plating / 29.2 Horizontal Electroplating / 29.4 Copper Electroplating General Issues / 29.6 Acid Copper Sulfate Solutions and Operation / 29.14 Solder (Tin-Lead) Electroplating / 29.19 Tin Electroplating / 29.21 Nickel Electroplating / 29.23 Gold Electroplating / 29.25 Platinum Metals / 29.28 Silver Electroplating / 29.29
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CONTENTS
QR-Code Maker In .NET Framework
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29.13 Laboratory Process control / 29.29 29.14 Acknowledgment / 29.31 References / 29.31
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30. Direct Plating
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30.1 Direct Metallization Technology / 30.1 References / 30.11
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31. PWB Manufacture Using Fully Electroless Copper
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31.1 Fully Electroless Plating / 31.1 31.2 The Additive Process and its Variations / 31.2 31.3 Pattern-Plating Additive / 31.2 31.4 Panel-Plate Additive / 31.7 31.5 Partly Additive / 31.8 31.6 Chemistry of Electroless Plating / 31.9 31.7 Fully Electroless Plating Issues / 31.12 References / 31.14
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32. Printed Circuit Board Surface Finishes
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32.1 Introduction / 32.1 32.2 Alternative Finishes / 32.3 32.3 Hot Air Solder Level (Hasl or Hal) / 32.4 32.4 Electroless Nickel Immersion Gold (ENIG) / 32.6 32.5 Organic Solderability Preservative (OSP) / 32.8 32.6 Immersion Silver / 32.10 32.7 Immersion Tin / 32.11 32.8 Other Surface Finishes / 32.13 32.9 Assembly Compatibility / 32.14 32.10 Reliability Test Methods / 32.17 32.11 Special Topics / 32.18 32.12 Failure Modes / 32.19 32.13 Comparing Surface Finish Properties / 32.23 References / 32.23
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33. Solder Mask
33.1 33.2 33.3 33.4 33.5 33.6 33.7 33.8 Introduction / 33.1 Trends and Challenges for Solder Mask / 33.2 Types of Solder Mask / 33.3 Solder Mask Selection / 33.4 Solder Mask Application and Processing / 33.9 VIA Protection / 33.18 Solder Mask Final Properties / 33.19 Legend and Marking (Nomenclature) / 33.19
34. Etching Process and Technologies
34.1 34.2 34.3 34.4 34.5 34.6 34.7 Introduction / 34.1 General Etching Considerations and Procedures / 34.2 Resist Removal / 34.4 Etching Solutions / 34.6 Other Materials for Board Construction / 34.18 Metals Other than Copper / 34.19 Basics of Etched Line Formation / 34.20
CONTENTS
34.8 Equipment and Techniques / 34.26 References / 34.29
35. Machining and Routing
35.1 35.2 35.3 35.4 35.5 35.6 Introduction / 35.1 Punching Holes (Piercing) / 35.1 Blanking, Shearing, and Cutting of Copper-Clad Laminates / 35.3 Routing / 35.6 Scoring / 35.13 Acknowledgment / 35.15
Part 7
Bare Board Test
36. Bare Board Test Objectives and Definitions
36.1 36.2 36.3 36.4 Introduction / 36.3 The Impact of HDI / 36.3 Why Test / 36.4 Circuit Board Faults / 36.6
37. Bare Board Test Methods
37.1 37.2 37.3 37.4 37.5 37.6 Introduction / 37.1 Nonelectrical Testing Methods / 37.1 Basic Electrical Testing Methods / 37.2 Specialized Electrical Testing Methods / 37.9 Data and Fixture Preparation / 37.13 Combined Testing Methods / 37.20
38. Bare Board Test Equipment
38.1 38.2 38.3 38.4 38.5 38.6 Introduction / 38.1 System Alternatives / 38.1 Universal Grid Systems / 38.3 Flying-Probe/Moving-Probe Test Systems / 38.17 Verification and Repair / 38.21 Test Department Planning and Management / 38.22
39. HDI Bare Board Special Testing Methods
39.1 39.2 39.3 39.4 39.5 39.6 39.7 39.8 39.9 39.10 Introduction / 39.1 Fine-Pitch Tilt-Pin Fixtures / 39.2 Bending Beam Fixtures / 39.3 Flying Probe / 39.3 Coupled Plate / 39.3 Shorting Plate / 39.4 Conductive Rubber Fixtures / 39.5 Optical Inspection / 39.5 Noncontact Test Methods / 39.5 Combinational Test Methods / 39.7
CONTENTS
xiii
Part 8 Assembly
40. Assembly Processes
40.1 40.2 40.3 40.4 40.5 40.6 40.7 40.8 40.9 Introduction / 40.3 Through-Hole Technology / 40.5 Surface-Mount Technology / 40.16 Odd-Form Component Assembly / 40.42 Process Control / 40.48 Process Equipment Selection / 40.54 Repair and Rework / 40.57 Conformal Coating, Encapsulation, and Underfill Materials / 40.64 Acknowledgment / 40.66
41. Conformal Coating
41.1 Introduction / 41.1 41.2 Types of Conformal Coatings / 41.3 41.3 Product Preparation / 41.6 41.4 Application Processes / 41.7 41.5 Cure, Inspection, and Finishing / 41.11 41.6 Repair Methods / 41.13 41.7 Design for Conformal Coating / 41.14 References / 41.17
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