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Organics: Tape residues, mold growth, and cyanide breakdowns.
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29.10.1.1 Process Controls Analysis Gold content, pH, and density should be maintained at optimum values. Operation at very low gold content causes early bath breakdowns with loss of properties, less current efficiency, and less cost savings. The pH is raised by using potassium hydroxide and is lowered with acid salts. Solution conductivity is controlled by density, which is adjusted with conductivity salts. Hull cell is not recommended for this purpose. Anodes Platinized titanium should be replaced when operating voltages are excessive or when thick coatings develop on the anode surfaces. Recovery Plating solutions should be replaced when contaminated, when plating rates decrease, or after about 10 total gold content turnovers.
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29.10.1.2 Problems. Difficulties can be controlled by proper gold bath and equipment maintenance. Some typical situations follow:
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Discolored deposit This may be due to low brightener; to metal contaminants such as lead, low pH, low density, or organic contaminations; or to leaking from tape. Gold plate is stripped to evaluate nickel. For these problems, first try to lower the pH, raise the density, or increase the brightener before replacing the bath or using decreased current densities. Gold peeling from nickel This is generally due to inadequate solder stripping, leaky tape, or poor activation. Methods to increase nickel activation include increasing acid strength after nickel plating and using a fluoride activator, cathodic acid, or gold strike. A gold strike that is compatible with gold plate and has low metal content and low pH is available. Its main purpose is to maintain adhesion to the nickel substrate. Wide thickness range To narrow the thickness range, improve the solution movement between panels; clean, adjust, or replace anodes; and adjust or replace the solution. Low deposition rate This is characterized by excessive gassing and low efficiencies.To correct this condition, adjust solution parameters and check for contaminants such as chromium. Pitting Strip gold and evaluate nickel and copper by cross-sectioning. Resist breakdown Low current efficiencies cause this condition. Use solvent-soluble screened or dry film for best results.
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Pure 24-Karat Gold High-purity 99.99 percent gold processes are used for boards designed for semiconductor chip (die) attachment, wire bonding, and plating solder (leaded) glass devices, for their solderability and weldability. These qualities comply with Types I and III of MIL-G-45204. The processes are neutral (pH 6 to 8.5) or acid (pH 3 to 6). Pulse plating is frequently used. Table 29.11 gives typical conditions for a neutral bath.
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TABLE 29.11 Neutral Pure Gold: Operation and Control Gold content pH Temperature Agitation Solution density Replenishment Current efficient Cathode current density Deposition rate for 100 min., @5 A/ft2 Deposition composition Hardness 0.9 1.5 troy oz./gal 6.0 7.0 150 F Vigorous 12 15 Be 4 Ah/troy oz. 90 95% 1 10 A/ft2 8 min. 99.99% + gold 60 90 Knoop
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Alkaline, Noncyanide Gold Various processes for alloy and pure gold deposits are available. Solutions are based on sulfitegold complexes and arsenic additives and operate at a pH of 8.5 to 10.0. A decision to use this process is based primarily on the need for uniformity (leveling), hardness (180 Knoop), purity, reflectivity, and ductility. PC board use is limited to body plating, since wear characteristics of
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the sulfite-gold are not suitable for edge connector applications. The microelectronics industry uses these processes for reasons of safety and gold purity. Semiconductor chip attachment, wire bonding, and gold plating on semiconductors are possible applications and are enhanced by using pulse plating without metallic additives.
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Gold Plate Tests Several routine in-process and final quality control tests are performed on gold:
Thickness Techniques are based on beta-ray backscattering and x-ray fluorescence. Thickness and area sensitivity are as low as 1 min. with 5 mil pads. Adhesion Standard testing involves a tape pull test. Porosity Tests involve nitric acid vapor and electrographics. Purity Lead is a common impurity that must be controlled to <0.1 percent. Other tests included discoloration by heating, electrical contact, and wear resistance.
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