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ELECTROPLATING
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is that defects in copper plating frequently are not shown by this method. For example, Hull cell testing will not help in detecting dull plating, roughness, or pitting. The procedure starts with brass panel preparation, in the following order: 1. 2. 3. 4. Remove the plastic film. Treat with cathodic alkaline cleaner. Soak in 10 percent sulfuric acid. Rinse.
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Repeat these steps until the panel is water-break free. Proceed with the Hull cell as follows: 1. 2. 3. 4. 5. Rinse with test solution. Fill to mark. Adjust temperature and agitation. Attach panel to negative terminal. Plate.
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Agitation should be similar to tank operation that is, vigorous air bubbling for copper, gentle stirring for tin and tin-lead, and none for tin-nickel. Plate copper and nickel at 2 A and other metals at 1 A. The effects of bath adjustment, carbon treatment, dummy plating, and so on, are readily translated from the Hull cell to actual tank operations. See previous sections on metal plating for Hull cell results, and consult the supplier for test equipment.
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ACKNOWLEDGMENT
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Significant portions of this chapter are drawn from George Milad, Electroplating, Printed Circuits Handbook, 5th ed, Clyde Coombs (ed.), 2001, Chap. 29.
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REFERENCES
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1. Rothschild, B. F., Solder Plating of Printed Wiring Systems, Proceedings of the Printed Circuit Plating Symposium, California Circuits Association, November 5 6, 1969, pp. 10 21, and November 12 13, 1968, pp. 61 65. 2. Jacky, G. F., Soldering Experience with Electroplated Bright Acid Tin and Copper, Circuit Technology Today, California Circuits Association, October 1974, pp. 49 74. 3. Davis, P. E., and Duffek, E. F., The Proper Use of Tin and Tin Alloys in Electronics, Electronic Packaging and Production, Vol. 15, No. 7, 1975. 4. Kilbury, R. G., Producing Buried Via Multilayers: Two Approaches, Circuits Manufacturing, Vol. 25, No. 4, 1985, pp. 30 49. 5. Foulke, D. G., Electroplaters Process Control Handbook, rev. ed., R. E. Krieger Publishing Company, 1975. 6. Langford, K. E., and Parker, J. E., Analysis of Electroplating and Related Solutions, 4th ed., R. Draper Ltd., 1971. 7. See Ref. 64, Chap. 7, Additives. 8. Nelson, J. A., Basic Steps for Cross Sectioning, Insulation/Circuits, 1977. 9. Wellner, P., and Nelson, J., High Volume Cross Sectional Evaluation of Printed Circuit Boards, IPCWC- 4B-1, 1981.
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DIRECT PLATING
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Dr. Hayao Nakahara
N.T. Information Ltd., Huntington, New York
30.1 DIRECT METALLIZATION TECHNOLOGY*
For 40 years the PTH process of choice has been palladium followed by electroless copper, but there have been at least 12 DMT processes challenging that established process, with several hundred installations, a significant percentage of the total number of PCB shops. The basic idea for the palladium systems dates back to the Radovsky patent of 1963,1 which claimed a method of using an electrically nonconductive film of palladium in a semicolloidal form to directly metallize through holes in printed circuit boards. Radovsky s invention was never commercialized. The basic idea for the carbon/graphite systems dates back to the very early days of eyelet boards when Photocircuits was experimenting with graphite, silver, and other media to turn their single-sided PCBs into reliable double-sided boards.
30.1.1 Direct Metallization Technologies Overview From the many media and technical variations, some common elements have evolved. 30.1.1.1 Direct Metallization Technologies Common Elements. common to all DMT: There are two elements
1. Holes must be conditioned more specifically and thoroughly than for electroless copper. 2. Conductive media must be removed from the copper foil in a majority of the techniques (an exception is DMS-E). It is understood that additional desmear steps are necessary or advisable when processing multilayer PCBs. Common elements to all horizontal conveyorized DMT systems are:
Throughput is typically 6 to 15 min for a panel, with the next panel following 1 in behind Tremendous economies in rinse water use Lower consumption of chemicals
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