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Plating over microvias requires that they are totally filled, planarized, roughened, and catalyzed before the plating process. If a conductive plugging material is used, the catalysis step typically can be eliminated. Material selection for this application is particularly important because not many materials can withstand the roughening and plating and still maintain good adhesion of the copper to the plugging material after exposure to soldering temperatures. If the via is in a component mounting pad (via-in-pad), the plugging material must not shrink and cause a significant depression (dimple) in the pad. This is especially true for wire bonding applications that require a very flat planar surface.
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Environmental The Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC places restrictions upon specific materials that may be included in PCB fabrication materials, including solder masks. These requirements may require some products to be reformulated. Some products and/or markets may require low-halogen materials to comply with company or industry specifications. Again, these requirements have required some solder masks to be reformulated or new products to be developed. Many localities have strict air emissions regulations that limit the materials and the amount that may be exhausted to the atmosphere. Individual processes or pieces of equipment may require a permit to exhaust any volatile materials. Hazardous air pollutants (HAPs) and volatile organic components (VOCs) are of particular concern. Limits on these parameters can limit mask selection and application processes. For example, curtain coating and spray mask application are not viable in some areas due to the higher percentage of solvent needed for proper application. Screening utilizes solder mask at a much higher percent solids (less dilution), so air emissions may be only half that of other methods.
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Technical Service and Troubleshooting The solder mask process is quite complex. It relies upon all PCB fabrication processes that preceded it and plays a key role in all processes after it has been applied, through assembly and the life of the PCB. As a result, it is recommended that the specifying authority choose companies that can provide technical expertise and troubleshooting assistance. Companies that offer service and experienced engineering personnel in the PCB fabricators are becoming scarcer, making the supplier s ability to provide service a key issue in solder mask selection.
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Non-Imageable Early solder masks could not be photoimaged that is, placed in its exact location with a photographic process. They could not be hardened selectively in one area and then be removed from other areas. These masks had to be applied in the final pattern desired, typically through a patterned screen. The silk screening process (the screens are actually nylon) is limited in that it can neither resolve the fine features nor meet the registration requirements and tolerances needed for today s PCB designs. The use of these materials is limited to lower technology products.
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Imageable Higher-density circuitry, with its close tolerances and image reproduction requirements, has mandated the use of photoimageable solder mask. Assemblers need fine dams (or webs ) of
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FIGURE 33.1 An example of fine solder dams, or webs, imaged between fine pitch SMT pads.
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solder mask between fine-pitch component leads (see Fig. 33.1) to enable assembly with low defect rates. These webs are frequently as narrow as 0.003 in. and can be as narrow as 0.001 in. A photoimageable mask is required to meet these needs. Photoimageable masks are available in either liquid or dry-film forms. Liquids account for more than 98 percent of the products used, due to their lower cost, greater availability, ease of use, and acceptability in assembly processing. Dry-film masks require special application equipment, are expensive, are often not robust when used as a resist for final finishes such as ENIG or immersion tin, and are too thick for use in some assembly processes. 33.3.3 Temporary A number of temporary masks are used in PCB fabrication and assembly processing. The properties of these masks vary considerably depending upon the purpose for which they have been used. The typical application for these masks is to protect circuitry from plating and/or soldering. Various products can be removed mechanically by peeling ( peelable mask ) or by dissolving in cleaning chemistry. Since they do not become a permanent part of the finished assembly, there are no industry standards for these products. PCB fabricators and assemblers should be careful to verify the compatibility of any temporary mask with their solder mask(s) to avoid problems such as swelling, blistering, and so on.
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