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product should be selected that provides some tooth (a matte surface is a good indicator) instead of a bright shiny surface. Good rinsing and drying, and possibly a passivation chemistry, are important to avoid rapid staining of the copper since it is very active after chemical cleaning. Abrasive brush or compressed pad technology is generally acceptable for solder leveled panels, but if other final finishes such as ENIG or immersion tin are used, it may not provide sufficient adhesion. The abrasive in the brushes leaves directional scratches in the copper that can lead to the wicking of plating chemistries under the mask that will cause loss of adhesion around mask openings on copper. If this method is to be used, it should be followed by a chemical cleaning that will provide the microroughness needed for good adhesion. A very good alternative to abrasive or chemical cleaning is to impart an oxide to the copper surface. If the copper has not been cleaned or if there are residual etch resist metals on the surface, the copper will not oxidize. The oxide provides a fine structure and microroughness for very good adhesion. When using this technique, the fabricator should use a reduced oxide so that cleaning chemistries in subsequent processes will not attack the oxide layer and cause adhesion loss at the mask-copper interface. 33.5.1.1.3 Rinsing and Drying. After the cleaning step, the panel surfaces must be thoroughly rinsed with good quality water. City or well water is often inadequate due to high levels of minerals, particulates, and other contaminants. Poor water quality can lead to blistering of the mask and/or discoloration of the copper under the solder mask. Deionized (DI) water is the best rinsing agent, but reverse osmosis (RO)-treated water is also used effectively. After the panels have been rinsed, the drying step should remove the water from the panels both from the surface and from the holes. Air knives should be incorporated to blow out the holes and sweep the water from the surface. It is undesirable to dry water on the boards since any droplets that are dried will leave behind any dissolved minerals and other contaminants that had been in the water. 33.5.1.2 Other Metals 33.5.1.2.1 Gold, Tin, or Solder. If the gold-plated surface is perfectly clean, no surface preparation is required. However, if there is any question about cleanliness, or if the panels have been exposed to any chemical vapors or particulates, or have been awaiting solder mask for any appreciable time, they should be cleaned. Depending upon the extent of surface contamination, the panels can be only rinsed and dried, or may be cleaned in a mild detergent solution before rinsing and drying. Abrasive cleaning is not recommended. 33.5.1.2.2 Mixed Metals. Two good examples of the use of mixed metals are for panels that have been selectively solder-stripped and for panels that have had fingers or contacts plated with gold before the solder mask process. The surface preparation process must be selected based upon the most delicate of the metals on the panel.
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Solder Mask Application 33.5.2.1 Liquid Masks. Solder masks applied in liquid form can be either photoimageable or not. Most solder mask in use today is photoimageable, meaning that after application it will be patterned in a photolithographic process. A non-imageable product must be applied only to those areas to be coated, and areas where metal or base material must be exposed cannot be coated. 33.5.2.1.1 Application Liquid Photoimageable (LPI) Solder Mask. LPI solder masks are applied typically by screen printing, spray, or curtain coating. Although each method has pros and cons, all are used successfully in the industry. Screen printing is the most common technique of applying solder mask. This technique utilizes a non-imaged, tightly stretched screen of precise construction and a squeegee to apply the solder mask through the screen onto the panel. The screening technology includes a wide range of equipment and techniques, from single-sided hand screening to fully automated double-sided equipment:
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