barcode scanner integration in asp.net SOLDER MASK in Software

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Curing 33.5.3.1 Cure Purpose. All solder mask products require a cure step or process for the solder mask to achieve the desired material properties. Curing typically increases hardness and the thermal and chemical resistance. The desired curing process is determined by the specific solder mask used. Consult the technical data sheet for the product and follow the supplier s recommendations for the appropriate cure. 33.5.3.2 Types of Cure UV, Thermal, IR. 33.5.3.2.1 Thermal Cure. Nearly all solder masks require a thermal cure. It is generally specified as a specific time at temperature. When calculating the correct time, the fabricator must add the temperature ramp-up time to the required time at temperature to arrive at the total time in the oven. For a conveyorized oven, a thermal profile will show the time above the minimum temperature. If the thermal cure is to be accomplished with an infrared oven, the time will be much shorter but temperatures will be far greater than for a convection oven. Also, a number of recipes are usually needed to compensate for materials with different IR absorbance and panels with different thermal mass or thickness. 33.5.3.2.2 UV Cure. Some solder masks require high-intensity UV light to cure. This is typically applied in a conveyorized UV curing unit. Calibration of the curing unit is important to ensure the solder mask is cured properly. 33.5.3.3 Effects of Undercure and Overcure. Improperly cured solder mask can exhibit poor properties that will become apparent in subsequent processing. Care must be taken to ensure that the solder mask is cured according to the supplier s recommendations. The following are some of the potential problems caused by improperly cured solder mask. Undercure problems include:
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Blistering or adhesion loss in final finish or assembly High ionic contamination Residues from assembly soldering Solder balling Handling damage and soft coating Overcure problems include:
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Embrittlement and cracking Adhesion loss
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Stripping Solder Mask Stripping of solder mask is something to be avoided, but at times is required due to problems such as misregistration, incorrect or wrong sized artwork, handling damage, and so on. It is important to recognize problems as early in the process as possible since the stripping process must be more aggressive after each process step. 33.5.4.1 Stripping after Coating. At this stage, the solder mask may be removed easily. An LPI solder mask can simply be developed off. (Note: The mask should be tack dried first to avoid contaminating the developer with wet mask and/or solvent.). UV and thermal mask must be removed manually with an appropriate solvent. 33.5.4.2 Stripping after Photoimaging. The stripping task becomes more difficult. Aggressive chemistries, typically highly caustic and at high temperature, are required.
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PRINTED CIRCUITS HANDBOOK
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These chemistries are aggressive and the process, if not controlled, can damage the butter coat of the laminate and render the panel scrap. Small holes filled with solder mask may not be able to be cleaned out in the stripping operation without damaging the panel. 33.5.4.3 Stripping after Cure. Stripping solder masks is most difficult at this stage, and doing so in fact may be impossible for some solder masks. The time required to strip the solder mask may allow exposed portions of the laminate to become damaged and cause the panel to be scrapped. Every effort should be made to identify panels needing stripping before curing.
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VIA PROTECTION
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Via protection is an increasingly complex issue for PCB designers and fabricators. There are multiple options for protection organic and conductive, platable or not, before or after final finish, and more. The materials and processes for each type are not the same, so there is no single answer, and few answers that are easily performed with high productivity. Inks for plugging come in a variety of processing types, including thermal cure, UV cure, photoimageable, conductive, platable, and so on.The panel design will narrow the choice for the specific application.
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33.6.1 IPC-4761, Design Guide for Protection of Printed Board Via Structures IPC-4761, published in July 2006, gives excellent guidance for how best to protect vias and what not to do. It does not give specifications for the plugging materials themselves, but a future document is expected to do so. This document calls out a number of classes of via protection that can be used by designers and fabricators. One very important message from this document is that vias should be protected from both sides, not only one side. If single-sided protection is used before an inert final finish, a ring void of copper results at the barrel-plug interface that is subject to corrosion due to entrapped microetch, flux, or other corrosive chemistry. Also, some of these materials leach out in subsequent processes and can kill plating baths, cause high ionics, induce electrochemical migration, or present other long-term reliability concerns. 33.6.2 Material Specifications Although there are no official specifications for the materials used for plugging, there are some specifications that apply to solder mask that should be considered when using a material other than solder mask to protect vias. UL94 flammability and IPC-SM-840 tests including especially resistance to solvents and cleaning agents, as well as non-nutrient testing may be necessary. Dependent upon the specific circuitry design, other specific tests from IPC-SM-840 or other specifications may be appropriate. 33.6.3 Material Selection Considerations Solder Mask versus Specialty Inks 33.6.3.1 Shrinkage Percent Solids. LPI solder masks have solvent in the formulation to control viscosity and tackiness. Drying the solvent causes the plug of mask in the via to shrink, typically causing a dimple and some thinning of the coverage on the knee of the hole. This may not be a problem if the plug is covered with another coating of solder mask or if the annular ring of the via does not pick up solder or other final finish. Specialty hole plugging inks are available that are very high in solids and shrink very little, as are 100 percent solid inks that eliminate this concern.
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